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M5M4V4265CJ-7S PDF预览

M5M4V4265CJ-7S

更新时间: 2024-11-29 03:02:27
品牌 Logo 应用领域
三菱 - MITSUBISHI 存储内存集成电路光电二极管动态存储器
页数 文件大小 规格书
31页 314K
描述
EDO (HYPER PAGE) MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM

M5M4V4265CJ-7S 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:SOJ
包装说明:SOJ, SOJ40,.44针数:40
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.73
Is Samacsys:N访问模式:FAST PAGE WITH EDO
最长访问时间:70 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
备用内存宽度:8I/O 类型:COMMON
JESD-30 代码:R-PDSO-J40JESD-609代码:e0
长度:26.04 mm内存密度:4194304 bit
内存集成电路类型:EDO DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:40字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ40,.44封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:512座面最大高度:3.55 mm
自我刷新:YES最大待机电流:0.0001 A
子类别:DRAMs最大压摆率:0.11 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:J BEND
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

M5M4V4265CJ-7S 数据手册

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MITSUBISHI LSIs  
M5M4V4265CJ,TP-5,-6,-7,-5S,-6S,-7S  
EDO (HYPER PAGE) MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM  
DESCRIPTION  
PIN CONFIGURATION (TOP VIEW)  
This is a family of 262144-word by 16-bit dynamic RAMs with EDO  
mode fuction, fabricated with the high performance CMOS  
process, and is ideal for the buffer memory systems of personal  
computer graphics and HDD where high speed, low power  
dissipation, and low costs are essential. The use of double-layer  
metalization process technology and a single-transistor dynamic  
storage stacked capacitor cell provide high circuit density at  
reduced costs. The lower supply (3.3V) operation, due to the  
optimization of transistor structure, provides low power dissipation  
while maintaining high speed operation. Multiplexed address inputs  
permit both a reduction in pins and an increase in system  
densities. Self or extended refresh current is low enough for  
battery back-up application. This device has 2CAS and 1W  
terminals with a refresh cycle of 512 cycles every 8.2ms.  
1
2
(3.3V)VCC  
DQ1  
40 VSS(0V)  
39  
DQ16  
38  
DQ2  
3
4
DQ15  
37  
36  
35  
DQ14  
DQ3  
DQ4  
5
6
DQ13  
(3.3V)VCC  
DQ5  
VSS(0V)  
7
8
9
34 DQ12  
33 DQ11  
DQ6  
DQ7  
32  
31  
30  
29  
28  
DQ10  
DQ9  
NC  
DQ8 10  
FEATURES  
NC  
NC  
W
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Power  
dissipa-  
tion  
OE  
access  
time  
RAS  
access  
time  
CAS  
access access  
time time  
Address  
Cycle  
time  
(min.ns)  
LCAS  
Type name  
UCAS  
OE  
(typ.mW)  
(max.ns) (max.ns) (max.ns) (max.ns)  
27  
26  
RAS  
NC  
A0  
M5M4V4265CXX-5,-5S  
M5M4V4265CXX-6,-6S  
M5M4V4265CXX-7,-7S  
XX=TP,J  
13  
15  
20  
25  
30  
35  
50  
60  
70  
13  
15  
20  
408  
363  
333  
90  
110  
130  
A8  
25 A7  
24  
23  
22  
21  
A6  
A1  
A2  
Standard 40 pin SOJ, 44 pin TSOP (II)  
Single 3.3±0.3V supply  
Low stand-by power dissipation  
CMOS Input level  
A5  
A4  
A3  
VSS(0V)  
(3.3V)VCC  
1.8mW (Max)  
CMOS Input level  
360µW (Max) *  
Operating power dissipation  
M5M4V4265CXX-5,-5S  
M5M4V4265CXX-6,-6S  
M5M4V4265CXX-7,-7S  
Self refresh capability *  
Self refresh current  
Extended refresh capability  
Extended refresh current  
EDO mode (512-column random access), Read-modify-write, RAS-  
only refresh, CAS before RAS refresh, Hidden refresh capabilities.  
Early-write mode, OE and W to control output buffer impedance  
512 refresh cycles every 8.2ms (A0~A8)  
Outline 40P0K (400mil SOJ)  
486mW (Max)  
432mW (Max)  
396mW (Max)  
1
2
(3.3V)VCC  
DQ1  
44 VSS(0V)  
43  
DQ16  
100µA (Max)  
100µA (Max)  
42  
DQ2  
3
4
DQ15  
41  
40  
39  
DQ14  
DQ13  
DQ3  
DQ4  
5
6
(3.3V)VCC  
DQ5  
VSS(0V)  
DQ12  
7
8
38  
512 refresh cycles every 128ms (A0~A8) *  
DQ11  
DQ10  
DQ9  
DQ6  
37  
36  
Byte or word control for Read/Write operation (2CAS, 1W type)  
* : Applicable to self refresh version (M5M4V4265CJ,TP-5S,-6S,  
-7S : option) only  
DQ7  
9
10  
DQ8  
35  
APPLICATION  
Microcomputer memory, Refresh memory for CRT, Frame buffer  
NC  
NC  
W
32  
31  
30  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
NC  
memory for CRT  
LCAS  
PIN DESCRIPTION  
UCAS  
OE  
Pin name  
A0~A8  
Function  
Address inputs  
29  
28  
RAS  
NC  
A0  
A8  
DQ1~DQ16  
RAS  
Data inputs / outputs  
27 A7  
Row address strobe input  
26  
25  
24  
23  
A6  
A1  
A2  
Lower byte control  
column address strobe input  
LCAS  
A5  
A4  
A3  
Upper byte control  
UCAS  
W
column address strobe input  
(3.3V)VCC  
VSS(0V)  
Write control input  
Output enable input  
Power supply (+3.3V)  
Ground (0V)  
OE  
VCC  
Outline 44P3W-R (400mil TSOP Nomal Bend)  
VSS  
NC : NO CONNECTION  
1
M5M4V4265CJ,TP-5,-5S:under development  

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