MITSUBISHI LSIs
MITSUBISHI LSIs
M5M4V4265CJ,TP-5,-6,-7,-5S,-6S,-7S
M5M4V4265CJ,TP-5,-6,-7,-5S,-6S,-7S
EDO (HYPER PAGE) MODE 19 304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
EDO (HYPER PAGE) MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
DESCRIPTION
PIN CONFIGURATION (TOP VIEW)
This is a family of 262144-word by 16-bit dynamic RAMs with EDO
mode fuction, fabricated with the high performance CMOS
process, and is ideal for the buffer memory systems of personal
computer graphics and HDD where high speed, low power
dissipation, and low costs are essential. The use of double-layer
metalization process technology and a single-transistor dynamic
storage stacked capacitor cell provide high circuit density at
reduced costs. The lower supply (3.3V) operation, due to the
optimization of transistor structure, provides low power dissipation
while maintaining high speed operation. Multiplexed address inputs
permit both a reduction in pins and an increase in system
densities. Self or extended refresh current is low enough for
battery back-up application. This device has 2CAS and 1W
terminals with a refresh cycle of 512 cycles every 8.2ms.
1
2
(3.3V)VCC
DQ1
40 VSS(0V)
39
DQ16
38
DQ2
3
4
DQ15
37
36
35
DQ14
DQ3
DQ4
5
6
DQ13
(3.3V)VCC
DQ5
VSS(0V)
7
8
9
34 DQ12
33 DQ11
DQ6
DQ7
32
31
30
29
28
DQ10
DQ9
NC
DQ8 10
FEATURES
NC
NC
W
11
12
13
14
15
16
17
18
19
20
Power
dissipa-
tion
OE
access
time
RAS
access
time
CAS
access access
time time
Address
Cycle
time
(min.ns)
LCAS
Type name
UCAS
OE
(typ.mW)
(max.ns) (max.ns) (max.ns) (max.ns)
27
26
RAS
NC
A0
M5M4V4265CXX-5,-5S
M5M4V4265CXX-6,-6S
M5M4V4265CXX-7,-7S
XX=TP,J
13
15
20
25
30
35
50
60
70
13
15
20
408
363
333
90
110
130
A8
25 A7
24
23
22
21
A6
A1
A2
Standard 40 pin SOJ, 44 pin TSOP (II)
Single 3.3±0.3V supply
Low stand-by power dissipation
CMOS Input level
A5
A4
A3
VSS(0V)
(3.3V)VCC
1.8mW (Max)
CMOS Input level
360µW (Max) *
Operating power dissipation
M5M4V4265CXX-5,-5S
M5M4V4265CXX-6,-6S
M5M4V4265CXX-7,-7S
Self refresh capability *
Self refresh current
Extended refresh capability
Extended refresh current
EDO mode (512-column random access), Read-modify-write, RAS-
only refresh, CAS before RAS refresh, Hidden refresh capabilities.
Early-write mode, OE and W to control output buffer impedance
512 refresh cycles every 8.2ms (A0~A8)
Outline 40P0K (400mil SOJ)
486mW (Max)
432mW (Max)
396mW (Max)
1
2
(3.3V)VCC
DQ1
44 VSS(0V)
43
DQ16
100µA (Max)
100µA (Max)
42
DQ2
3
4
DQ15
41
40
39
DQ14
DQ13
DQ3
DQ4
5
6
(3.3V)VCC
DQ5
VSS(0V)
DQ12
7
8
38
512 refresh cycles every 128ms (A0~A8) *
DQ11
DQ10
DQ9
DQ6
37
36
Byte or word control for Read/Write operation (2CAS, 1W type)
* : Applicable to self refresh version (M5M4V4265CJ,TP-5S,-6S,
-7S : option) only
DQ7
9
10
DQ8
35
APPLICATION
Microcomputer memory, Refresh memory for CRT, Frame buffer
NC
NC
W
32
31
30
13
14
15
16
17
18
19
20
21
22
NC
memory for CRT
LCAS
PIN DESCRIPTION
UCAS
OE
Pin name
A0~A8
Function
Address inputs
29
28
RAS
NC
A0
A8
DQ1~DQ16
RAS
Data inputs / outputs
27 A7
Row address strobe input
26
25
24
23
A6
A1
A2
Lower byte control
column address strobe input
LCAS
A5
A4
A3
Upper byte control
UCAS
W
column address strobe input
(3.3V)VCC
VSS(0V)
Write control input
Output enable input
Power supply (+3.3V)
Ground (0V)
OE
VCC
Outline 44P3W-R (400mil TSOP Nomal Bend)
VSS
NC : NO CONNECTION
1
M5M4V4265CJ,TP-5,-5S:under development