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M48T559YMH PDF预览

M48T559YMH

更新时间: 2024-11-13 22:17:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 静态存储器双倍数据速率
页数 文件大小 规格书
18页 149K
描述
64 Kbit 8Kb x8 TIMEKEEPER SRAM with ADDRESS/DATA MULTIPLEXED

M48T559YMH 数据手册

 浏览型号M48T559YMH的Datasheet PDF文件第2页浏览型号M48T559YMH的Datasheet PDF文件第3页浏览型号M48T559YMH的Datasheet PDF文件第4页浏览型号M48T559YMH的Datasheet PDF文件第5页浏览型号M48T559YMH的Datasheet PDF文件第6页浏览型号M48T559YMH的Datasheet PDF文件第7页 
M48T559Y  
®
64 Kbit (8Kb x8) TIMEKEEPER SRAM  
with ADDRESS/DATA MULTIPLEXED  
SOFTWARE and HARDWARE RESET for  
SNAPHAT (SH)  
Battery/Crystal  
WATCHDOG TIMER  
REGISTER COMPATIBLE with M48T59  
TIMEKEEPER SRAM  
ADDRESS/DATA MULTIPLEXED I/O PINS  
WATCHDOG TIMER - MONITORS OUT of  
CONTROL PROCESSOR or HUNG BUS  
ALARM with WAKE-UP in BATTERY MODE  
28  
INTEGRATED ULTRA LOW POWER SRAM,  
REAL TIME CLOCK, POWER-FAIL CONTROL  
CIRCUIT and BATTERY  
1
SOH28 (MH)  
FREQUENCY TEST OUTPUT for REAL TIME  
CLOCK  
AUTOMATIC POWER-FAIL CHIP DESELECT  
and WRITE PROTECTION  
Figure 1. Logic Diagram  
WRITE PROTECT VOLTAGE  
(V  
PFD  
= Power-fail Deselect Voltage):  
– M48T559Y: 4.2V V  
4.5V  
PFD  
PACKAGING INCLUDES a 28-LEAD SOIC  
®
V
CC  
and SNAPHAT TOP  
(to be Ordered Separately)  
SOIC PACKAGE PROVIDES DIRECT  
CONNECTION for a SNAPHAT TOP  
CONTAINS the BATTERY and CRYSTAL  
8
AS0  
AS1  
AD0-AD7  
MICROPROCESSOR POWER-ON RESET  
W
RST  
(Valid even during battery back-up mode)  
R
IRQ/FT  
PROGRAMMABLE ALARM OUTPUT ACTIVE  
M48T559Y  
in the BATTERY BACK-UP MODE  
RSTIN1  
RSTIN2  
E
DESCRIPTION  
®
The M48T559Y TIMEKEEPER RAM is an 8K x 8  
non-volatile static RAM and real time clock. The  
monolithic chip is available in the SNAPHAT pack-  
age to provide a highly integrated battery backed-  
up memory and real time clock solution.  
WDI  
The 28 pin 330mil SOIC provides sockets with  
gold plated contacts at both ends for direct con-  
nection to a separate SNAPHAT housing contain-  
ing the battery and crystal. The unique design  
allows the SNAPHAT battery package to be  
mounted on top of the SOIC package after the  
completion of the surface mount process.  
V
SS  
AI01674B  
February 2000  
1/18  

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