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M471B5673GB0-CF8 PDF预览

M471B5673GB0-CF8

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率
页数 文件大小 规格书
37页 1085K
描述
DDR DRAM, 256MX64, 0.6ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204

M471B5673GB0-CF8 数据手册

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Rev. 1.1  
Unbuffered SODIMM  
datasheet  
DDR3 SDRAM  
1. DDR3 Unbuffered SODIMM Ordering Information  
Number of  
Height  
Part Number2  
Density  
Organization  
Component Composition  
Rank  
128Mx8(K4B1G0846G-BC##1)*8  
128Mx8(K4B1G0846G-BC##1)*16  
1GB  
2GB  
128Mx64  
256Mx64  
1
2
30mm  
30mm  
M471B2873GB0-CF8/H9/K0/MA  
M471B5673GB0-CF8/H9/K0/MA  
NOTE :  
1. "##" - F8/H9/K0/MA  
2. F8 - 1066Mbps 7-7-7 / H9 - 1333Mbps 9-9-9 / K0 - 1600Mbps 11-11-11/ MA - 1866Mbps 13-13-13  
- DDR3-1866(13-13-13) is backward compatible to DDR3-1600(11-11-11), DDR3-1333(9-9-9), DDR3-1066(7-7-7)  
- DDR3-1600(11-11-11) is backward compatible to DDR3-1333(9-9-9), DDR3-1066(7-7-7)  
- DDR3-1333(9-9-9) is backward compatible to DDR3-1066(7-7-7)  
2. Key Features  
DDR3-800  
6-6-6  
2.5  
DDR3-1066  
7-7-7  
DDR3-1333  
9-9-9  
1.5  
DDR3-1600  
11-11-11  
1.25  
DDR3-1866  
13-13-13  
1.07  
Speed  
Unit  
tCK(min)  
CAS Latency  
tRCD(min)  
tRP(min)  
1.875  
7
ns  
tCK  
ns  
6
9
11  
13  
15  
13.125  
13.125  
37.5  
13.5  
13.5  
36  
13.75  
13.75  
35  
13.91  
13.91  
34  
15  
ns  
tRAS(min)  
tRC(min)  
37.5  
52.5  
ns  
50.625  
49.5  
48.75  
47.91  
ns  
JEDEC standard 1.5V ± 0.075V Power Supply  
VDDQ = 1.5V ± 0.075V  
400MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin, 667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin,  
933MHz fCK for 1866Mb/sec/pin  
8 independent internal bank  
Programmable CAS Latency: 5,6,7,8,9,10,11,13  
Programmable Additive Latency(Posted CAS) : 0, CL - 2, or CL - 1 clock  
Programmable CAS Write Latency(CWL) = 5 (DDR3-800), 6 (DDR3-1066), 7 (DDR3-1333), 8 (DDR3-1600) and 9 (DDR3-1866)  
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or  
write [either On the fly using A12 or MRS]  
Bi-directional Differential Data Strobe  
On Die Termination using ODT pin  
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE 95°C  
Asynchronous Reset  
3. Address Configuration  
Organization  
Row Address  
Column Address  
Bank Address  
Auto Precharge  
128x8(1Gb) based Module  
A0-A13  
A0-A9  
BA0-BA2  
A10/AP  
- 4 -  

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