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M471B5673GB0-CF8 PDF预览

M471B5673GB0-CF8

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率
页数 文件大小 规格书
37页 1085K
描述
DDR DRAM, 256MX64, 0.6ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204

M471B5673GB0-CF8 数据手册

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Rev. 1.1  
Unbuffered SODIMM  
datasheet  
DDR3 SDRAM  
Table Of Contents  
204pin Unbuffered SODIMM based on 1Gb G-die  
1. DDR3 Unbuffered SODIMM Ordering Information........................................................................................................4  
2. Key Features.................................................................................................................................................................4  
3. Address Configuration ..................................................................................................................................................4  
4. x64 DIMM Pin Configurations (Front side/Back Side)...................................................................................................5  
5. Pin Description .............................................................................................................................................................6  
6. Input/Output Functional Description..............................................................................................................................7  
7. Function Block Diagram:...............................................................................................................................................8  
7.1 1GB, 128Mx64 Module (Populated as 1 rank of x8 DDR3 SDRAMs)..................................................................... 8  
7.2 2GB, 256Mx64 Module (Populated as 2 ranks of x8 DDR3 SDRAMs) ................................................................... 9  
8. Absolute Maximum Ratings ..........................................................................................................................................10  
8.1 Absolute Maximum DC Ratings............................................................................................................................... 10  
8.2 DRAM Component Operating Temperature Range ................................................................................................ 10  
9. AC & DC Operating Conditions.....................................................................................................................................10  
9.1 Recommended DC Operating Conditions (SSTL-15).............................................................................................. 10  
10. AC & DC Input Measurement Levels..........................................................................................................................11  
10.1 AC & DC Logic Input Levels for Single-ended Signals.......................................................................................... 11  
10.2 VREF Tolerances.................................................................................................................................................... 12  
10.3 AC and DC Logic Input Levels for Differential Signals .......................................................................................... 13  
10.3.1. Differential Signals Definition ......................................................................................................................... 13  
10.3.2. Differential Swing Requirement for Clock (CK-CK) and Strobe (DQS-DQS) ................................................ 13  
10.3.3. Single-ended Requirements for Differential Signals ...................................................................................... 14  
10.3.4. Differential Input Cross Point Voltage ............................................................................................................ 15  
10.4 Slew Rate Definition for Single Ended Input Signals............................................................................................. 15  
10.5 Slew rate definition for Differential Input Signals................................................................................................... 15  
11. AC & DC Output Measurement Levels .......................................................................................................................16  
11.1 Single Ended AC and DC Output Levels............................................................................................................... 16  
11.2 Differential AC and DC Output Levels................................................................................................................... 16  
11.3 Single-ended Output Slew Rate ............................................................................................................................ 16  
11.4 Differential Output Slew Rate ................................................................................................................................ 17  
12. DIMM IDD specification definition...............................................................................................................................18  
13. IDD SPEC Table.........................................................................................................................................................20  
14. Input/Output Capacitance ...........................................................................................................................................21  
15. iElectrical Characteristics and AC timing ....................................................................................................................22  
15.1 Refresh Parameters by Device Density................................................................................................................. 22  
15.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ................................................................ 22  
15.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin................................................................. 22  
15.3.1. Speed Bin Table Notes .................................................................................................................................. 27  
16. Timing Parameters by Speed Grade ..........................................................................................................................28  
16.1 Jitter Notes ............................................................................................................................................................ 34  
16.2 Timing Parameter Notes........................................................................................................................................ 35  
17. Physical Dimensions :.................................................................................................................................................36  
17.1 128Mbx8 based 128Mx64 Module (1 Rank) - M471B2873GB0............................................................................ 36  
17.2 128Mbx8 based 256Mx64 Module (2 Ranks) - M471B5673GB0.......................................................................... 37  
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