是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | TFBGA, BGA325,21X21,20 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.77 |
其他特性: | LG-MIN, WD-MIN | JESD-30 代码: | S-PBGA-B325 |
JESD-609代码: | e1 | 长度: | 11 mm |
湿度敏感等级: | 3 | 输入次数: | 180 |
逻辑单元数量: | 27696 | 输出次数: | 180 |
端子数量: | 325 | 最高工作温度: | 85 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | TFBGA | 封装等效代码: | BGA325,21X21,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 250 | 电源: | 1.2 V |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 1.01 mm | 子类别: | Field Programmable Gate Arrays |
最大供电电压: | 1.26 V | 最小供电电压: | 1.14 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 11 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M2S025T-1FG144Y | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FG144YES | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FG144YI | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FG484Y | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 23988-Cell, CMOS, PBGA484, | |
M2S025T-1FG484YI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 23988-Cell, CMOS, PBGA484, | |
M2S025T-1FGG144Y | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FGG144YES | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FGG144YI | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs | |
M2S025T-1FGG484MX399 | MICROSEMI |
获取价格 |
Field Programmable Gate Array, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | |
M2S025T-1VF144Y | MICROSEMI |
获取价格 |
SmartFusion2 System-on-Chip FPGAs |