品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 闪存 | |
页数 | 文件大小 | 规格书 |
20页 | 159K | |
描述 | ||
4 Mbit 512Kb x8, Boot Block Low Voltage Single Supply Flash Memory |
是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | TSOP | 包装说明: | 10 X 20 MM, PLASTIC, TSOP-40 |
针数: | 40 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.45 | 最长访问时间: | 90 ns |
其他特性: | BOTTOM BOOT BLOCK | 启动块: | BOTTOM |
命令用户界面: | YES | 数据轮询: | YES |
耐久性: | 100000 Write/Erase Cycles | JESD-30 代码: | R-PDSO-G40 |
JESD-609代码: | e0 | 长度: | 18.4 mm |
内存密度: | 4194304 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
部门数/规模: | 1,2,1,7 | 端子数量: | 40 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 512KX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装等效代码: | TSSOP40,.8,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 并行/串行: | PARALLEL |
电源: | 3/3.3 V | 编程电压: | 2.7 V |
认证状态: | Not Qualified | 就绪/忙碌: | YES |
座面最大高度: | 1.2 mm | 部门规模: | 16K,8K,32K,64K |
最大待机电流: | 0.0001 A | 子类别: | Flash Memories |
最大压摆率: | 0.02 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 切换位: | YES |
类型: | NOR TYPE | 宽度: | 10 mm |
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