是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | TSOP |
包装说明: | 12 X 20 MM, PLASTIC, TSOP-48 | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.84 |
Is Samacsys: | N | 最长访问时间: | 150 ns |
备用内存宽度: | 8 | I/O 类型: | COMMON |
JESD-30 代码: | R-PDSO-G48 | JESD-609代码: | e3 |
长度: | 18.4 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | OTP ROM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 2MX16 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP48,.8,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大待机电流: | 0.00006 A |
子类别: | OTP ROMs | 最大压摆率: | 0.03 mA |
最大供电电压 (Vsup): | 3.63 V | 最小供电电压 (Vsup): | 2.97 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 12 mm |
Base Number Matches: | 1 |
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32 Mbit (2Mb 】16) low-voltage UV EPROM and OT | |
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32 Mbit 2Mb x16 Low Voltage UV EPROM and OTP EPROM | |
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32 Mbit 2Mb x16 Low Voltage UV EPROM and OTP EPROM | |
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