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M1A3P400-1FG256I PDF预览

M1A3P400-1FG256I

更新时间: 2024-11-13 04:23:59
品牌 Logo 应用领域
美高森美 - MICROSEMI 可编程逻辑
页数 文件大小 规格书
221页 6478K
描述
Field Programmable Gate Array, 9216 CLBs, 400000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

M1A3P400-1FG256I 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:BGA,Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.24
JESD-30 代码:S-PBGA-B256长度:17 mm
湿度敏感等级:3可配置逻辑块数量:9216
等效关口数量:400000端子数量:256
最高工作温度:100 °C最低工作温度:-40 °C
组织:9216 CLBS, 400000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):225
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:1.8 mm最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD/TIN LEAD SILVER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:17 mmBase Number Matches:1

M1A3P400-1FG256I 数据手册

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Revision 18  
DS0097  
ProASIC3 Flash Family FPGAs  
with Optional Soft ARM Support  
Advanced I/O  
Features and Benefits  
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)  
High Capacity  
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Wide Range Power Supply Voltage Support per JESD8-B,  
Allowing I/Os to Operate from 2.7 V to 3.6 V  
15 K to 1 M System Gates  
Up to 144 Kbits of True Dual-Port SRAM  
Up to 300 User I/Os  
Bank-Selectable I/O Voltages—up to 4 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
Reprogrammable Flash Technology  
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS  
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS  
Process  
2.5 V / 5.0 V Input  
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and  
M-LVDS (A3P250 and above)  
Instant On Level 0 Support  
Single-Chip Solution  
Retains Programmed Design when Powered Off  
I/O Registers on Input, Output, and Enable Paths  
Hot-Swappable and Cold Sparing I/Os  
High Performance  
Programmable Output Slew Rate and Drive Strength  
350 MHz System Performance  
Weak Pull-Up/-Down  
3.3 V, 66 MHz 64-Bit PCI  
IEEE 1149.1 (JTAG) Boundary Scan Test  
Pin-Compatible Packages across the ProASIC3 Family  
In-System Programming (ISP) and Security  
Clock Conditioning Circuit (CCC) and PLL†  
ISP Using On-Chip 128-Bit Advanced Encryption Standard  
®
®
(AES) Decryption (except ARM -enabled ProASIC 3 devices)  
Six CCC Blocks, One with an Integrated PLL  
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities  
and External Feedback  
via JTAG (IEEE 1532–compliant)  
®
FlashLock to Secure FPGA Contents  
Low Power  
Wide Input Frequency Range (1.5 MHz to 350 MHz)  
Embedded Memory†  
Core Voltage for Low Power  
Support for 1.5 V-Only Systems  
Low-Impedance Flash Switches  
1 Kbit of FlashROM User Nonvolatile Memory  
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM  
High-Performance Routing Hierarchy  
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)  
Segmented, Hierarchical Routing and Clock Structure  
True Dual-Port SRAM (except ×18)  
ARM Processor Support in ProASIC3 FPGAs  
®
®
M1 ProASIC3 Devices—ARM Cortex -M1 Soft Processor  
Available with or without Debug  
1
ProASIC3 Devices  
Cortex-M1 Devices  
System Gates  
A3P015  
A3P030  
A3P060 A3P125  
A3P250  
A3P400  
A3P600  
A3P1000  
2
M1A3P250 M1A3P400  
M1A3P600 M1A3P1000  
15,000  
30,000  
60,000 125,000  
250,000  
400,000  
600,000  
1,000,000  
Typical Equivalent Macrocells  
VersaTiles (D-flip-flops)  
RAM Kbits (1,024 bits)  
4,608-Bit Blocks  
128  
384  
256  
768  
512  
1,536  
18  
4
1,024  
3,072  
36  
2,048  
6,144  
36  
9,216  
54  
13,824  
108  
24  
24,576  
144  
32  
8
8
12  
FlashROM Kbits  
1
1
1
1
1
1
1
1
3
Secure (AES) ISP  
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Integrated PLL in CCCs  
4
VersaNet Globals  
6
6
18  
2
18  
18  
18  
18  
18  
I/O Banks  
2
2
2
4
4
4
4
Maximum User I/Os  
49  
81  
96  
133  
157  
194  
235  
300  
Notes:  
1. A3P015 is not recommended for new designs.  
2. Refer to the Cortex-M1 product brief for more information.  
3. AES is not available for Cortex-M1 ProASIC3 devices.  
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.  
5. The M1A3P250 device does not support this package.  
6. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs datasheet.  
7. Package not available.  
† A3P015 and A3P030 devices do not support this feature.  
‡ Supported only by A3P015 and A3P030 devices.  
March 2016  
© 2016 Microsemi Corporation  
I

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