Datasheet > M-78-NZ

M-78-NZ

更新时间： 2024-11-12 11:35:47

品牌	Logo	应用领域
MAKE-PS		转换器
页数	文件大小	规格书
3页	348K
描述
Single Output DC/DC Converter

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中文翻译

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M-78-NZ 数据手册

www.make-ps.com

E-mail:info@make-ps.com

Single Output

DC/DC Converter

Series M-78-NZ

FEATURES:

• No heatsink required

• 3 Pin SIP package

Up to 7.5 Watt | DC-DC Converter

• Non-isolated

• Low ripple and noise

• RoHS compliant

• Operating temperature -40°C to +85°C

• Very high efficiency up to 96%

• Pin compatible to multiple manufacturers

• Regulated outputs

Models

Single output

Input Voltage

(V)

Output Voltage

Output Current

Efficiency

Vin Max (%)

Efficiency

Vin Min (%)

Model

(V)

3.3

6.5

max (mA)

500

M-783.3-NZ

M-785.0-NZ

M-786.5-NZ

M-789.0-NZ

M-7812-NZ

M-7815-NZ

4.5-30

6.5-30

8-30

11-30

15-30

18-30

NOTE: All specifications in this datasheet are measured at an ambient temperature of 25°C, humidity<75%, nominal input voltage and at

rated output load unless otherwise specified.

Input Specifications

Parameters

Conditions

Typical

Maximum

Units

Voltage range

See the table above

VDC

Filter

Capacitor

Quiescent current

Short circuit consumption

Vin=(LL-HL) at 0% load

1.8

Output Specifications

Parameters

Conditions

Typical

Maximum

Units

Voltage accuracy

100% load

±3

Short circuit protection

Short circuit restart

Output current limit

Thermal shutdown

Line voltage regulation

Load voltage regulation

Temperature coefficient

Ripple & Noise

Continuous

Auto recovery

^oC

Internal IC junction

Vin=(LL-HL) at full load

10-100% load

-40°C to +85°C ambient

20MHz Bandwidth

160

±1

±0.75

±0.02

%/^oC

mV p-p

Max capacitive load

1000

General Specifications

Parameters

Switching frequency

Operating temperature

Storage temperature

Maximum case temperature

Cooling

Conditions

100% load

Typical

330

Maximum

Units

KHz

^oC

With derating above 71 ^oC

-40 to +85

-55 to +125

^oC

100

^oC

Free air convection

Humidity

Case material

Non-conductive black plastic (UL94V-0 rated)

Weight

Dimensions (L x W x H)

MTBF

Soldering temperature

0.45 x 0.30 x 0.40 inches 11.50 x 7.55 x 10.20 mm

> 2 000 000 hrs (MIL-HDBK-217F, Ground Benign, t=+25 ^oC)

1.5 mm from case for 10 sec

300

^oC

1 of 3

12 3

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