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M7A3P1000-2FGG256 PDF预览

M7A3P1000-2FGG256

更新时间： 2024-11-12 20:52:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟栅可编程逻辑
页数 文件大小 规格书
220页 10663K
描述
Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

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M7A3P1000-2FGG256 技术参数

是否Rohs认证： 符合生命周期：Not Recommended
包装说明：BGA,Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.25
最大时钟频率：350 MHzJESD-30 代码：S-PBGA-B256
JESD-609代码：e1长度：17 mm
湿度敏感等级：3可配置逻辑块数量：24576
等效关口数量：1000000端子数量：256
最高工作温度：70 °C最低工作温度：
组织：24576 CLBS, 1000000 GATES封装主体材料：PLASTIC/EPOXY
封装代码：BGA封装形状：SQUARE
封装形式：GRID ARRAY峰值回流温度（摄氏度）：260
可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY认证状态：Not Qualified
座面最大高度：1.8 mm最大供电电压：1.575 V
最小供电电压：1.425 V标称供电电压：1.5 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：1 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：40
宽度：17 mmBase Number Matches：1

M7A3P1000-2FGG256 数据手册

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Revision 13  
ProASIC3 Flash Family FPGAs  
with Optional Soft ARM Support  
Advanced I/O  
Features and Benefits  
•
•
•
700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)  
High Capacity  
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Wide Range Power Supply Voltage Support per JESD8-B,  
Allowing I/Os to Operate from 2.7 V to 3.6 V  
•
•
•
15 k to 1 M System Gates  
Up to 144 kbits of True Dual-Port SRAM  
Up to 300 User I/Os  
•
•
Bank-Selectable I/O Voltages—up to 4 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
Reprogrammable Flash Technology  
†
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS  
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS  
Process  
2.5 V / 5.0 V Input  
•
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and  
M-LVDS (A3P250 and above)  
•
•
•
Instant On Level 0 Support  
Single-Chip Solution  
Retains Programmed Design when Powered Off  
•
•
•
•
•
•
I/O Registers on Input, Output, and Enable Paths  
‡
Hot-Swappable and Cold Sparing I/Os  
High Performance  
†
Programmable Output Slew Rate and Drive Strength  
•
•
350 MHz System Performance  
Weak Pull-Up/-Down  
†
3.3 V, 66 MHz 64-Bit PCI  
IEEE 1149.1 (JTAG) Boundary Scan Test  
Pin-Compatible Packages across the ProASIC3 Family  
In-System Programming (ISP) and Security  
Clock Conditioning Circuit (CCC) and PLL†  
•
ISP Using On-Chip 128-Bit Advanced Encryption Standard  
®
®
(AES) Decryption (except ARM -enabled ProASIC 3 devices)  
•
•
Six CCC Blocks, One with an Integrated PLL  
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities  
and External Feedback  
†
via JTAG (IEEE 1532–compliant)  
®
•
FlashLock to Secure FPGA Contents  
Low Power  
•
Wide Input Frequency Range (1.5 MHz to 350 MHz)  
Embedded Memory†  
•
•
•
Core Voltage for Low Power  
Support for 1.5 V-Only Systems  
Low-Impedance Flash Switches  
•
•
1 kbit of FlashROM User Nonvolatile Memory  
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM  
†
High-Performance Routing Hierarchy  
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)  
•
Segmented, Hierarchical Routing and Clock Structure  
•
True Dual-Port SRAM (except ×18)  
ARM Processor Support in ProASIC3 FPGAs  
®
•
M1 ProASIC3 Devices—ARM Cortex™-M1 Soft Processor  
Available with or without Debug  
1
ProASIC3 Devices  
Cortex-M1 Devices  
System Gates  
A3P015  
A3P030  
A3P060 A3P125  
A3P250  
A3P400  
A3P600  
A3P1000  
2
M1A3P250 M1A3P400  
M1A3P600 M1A3P1000  
15,000  
30,000  
60,000 125,000  
250,000  
400,000  
600,000  
1,000,000  
Typical Equivalent Macrocells  
VersaTiles (D-flip-flops)  
RAM Kbits (1,024 bits)  
4,608-Bit Blocks  
128  
384  
–
256  
768  
–
512  
1,536  
18  
4
1,024  
3,072  
36  
2,048  
6,144  
36  
–
9,216  
54  
–
13,824  
108  
24  
–
24,576  
144  
32  
–
–
8
8
12  
FlashROM Kbits  
1
1
1
1
1
1
1
1
3
Secure (AES) ISP  
–
–
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Yes  
1
Integrated PLL in CCCs  
–
–
4
VersaNet Globals  
6
6
18  
2
18  
18  
18  
18  
18  
I/O Banks  
2
2
2
4
4
4
4
Maximum User I/Os  
49  
81  
96  
133  
157  
194  
235  
300  
Package Pins  
5
QFN  
QN68  
QN48, QN68,  
QN132  
QN132  
QN132  
QN132  
CS  
CS121  
VQ100  
TQ144  
VQFP  
TQFP  
PQFP  
FBGA  
VQ100  
VQ100  
TQ144  
PQ208  
VQ100  
PQ208  
PQ208  
PQ208  
PQ208  
5
FG144  
FG144 FG144/256  
FG144/256/ FG144/256/ FG144/256/  
484  
484  
484  
Notes:  
1. A3P015 is not recommended for new designs.  
2. Refer to the Cortex-M1 product brief for more information.  
3. AES is not available for Cortex-M1 ProASIC3 devices.  
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.  
5. The M1A3P250 device does not support this package.  
6. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs datasheet.  
† A3P015 and A3P030 devices do not support this feature.  
‡ Supported only by A3P015 and A3P030 devices.  
January 2013  
I
© 2013 Microsemi Corporation  
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M7A3P1000-2PQ208I ACTEL

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M7A3P1000-2PQ208I MICROSEMI

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M7A3P1000-FG256I ACTEL

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 		Field Programmable Gate Array, 1000000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256
M7A3P1000-FG484I ACTEL

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M7A3P1000-FGG144 MICROSEMI

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M7A3P1000-FGG256 MICROSEMI

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 		Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA256, 17 X 17 M
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 		Field Programmable Gate Array, 24576 CLBs, 1000000 Gates, 350MHz, CMOS, PBGA484, 23 X 23 M
M7A3P1000-PQG208I ACTEL

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