Datasheet > LV1150M

LV1150M

更新时间： 2024-10-27 22:46:51

品牌	Logo	应用领域
三洋 - SANYO		商用集成电路光电二极管信息通信管理
页数	文件大小	规格书
9页	99K
描述
Virtual Surround System IC

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技术参数
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LV1150M 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	DFP	包装说明：	SOP, SOP24,.4
针数：	24	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.92
Is Samacsys：	N	商用集成电路类型：	CONSUMER CIRCUIT
JESD-30 代码：	R-PDSO-G24	JESD-609代码：	e0
长度：	15.3 mm	功能数量：	1
端子数量：	24	最高工作温度：	70 °C
最低工作温度：	-20 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装等效代码：	SOP24,.4
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	NOT SPECIFIED	电源：	7 V
认证状态：	Not Qualified	座面最大高度：	2.5 mm
子类别：	Other Consumer ICs	最大压摆率：	40 mA
最大供电电压 (Vsup)：	10 V	最小供电电压 (Vsup)：	6.5 V
表面贴装：	YES	技术：	BICMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.9 mm	Base Number Matches：	1

LV1150M 数据手册

Ordering number :ENN6287

Bi-CMOS IC

LV1150M

Virtual Surround System IC

Overview

Package Dimensions

The LV1150M is a virtual surround system Bi-CMOS IC

for video soundtracks and audio.

unit: mm

3045B-MFP24

The main feature of this IC is the ability to create an audio

ambience equivalent to that of a multichannel system by

adding a signal to which virtual surround processing has

been applied to the left and right channel input signals. It

furthermore allows modification of this effect by the use

of L+R and L–R passive matrix processing and adjustment

of the surround processing level with a level control.

[LV1150M]

Functions and Features

• Virtual surround function

• Passive matrix: L+R, L–R

15.3

0.15

• Adjustable surround effect level

• Bypass and virtual surround (L+R, L–R) switching

function

0.35

1.27

0.67

SANYO: MFP24

• Output filters are provided on chip.

• On-chip V circuit

• ADM technique based A/D and D/A converters

• Simulated stereo for monaural input signals

• Package: MFP24 (375-mil lead pitch)

Specifications

Absolute Maximum Ratings at Ta = 25°C

Parameter

Maximum supply voltage

Symbol

V_CCmax

Pdmax

Topr

Conditions

Ratings

Unit

Allowable power dissipation

Operating temperature

Storage temperature

Ta ≤ 70°C * With printed circuit board

500

–20 to +70

°C

Tstg

–40 to +125

Note: * Printed circuit board size: 114.3 × 76.1 mm, t = 1.6 mm. Material: Glass epoxy.

Any and all SANYO products described or contained herein do not have specifications that can handle

applications that require extremely high levels of reliability, such as life-support systems, aircraft’s

control systems, or other applications whose failure can be reasonably expected to result in serious

physical and/or material damage. Consult with your SANYO representative nearest you before using

any SANYO products described or contained herein in such applications.

SANYO assumes no responsibility for equipment failures that result from using products at values that

exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other

parameters) listed in products specifications of any and all SANYO products described or contained

herein.

SANYO Electric Co.,Ltd. Semiconductor Company

TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN

73099RM (OT) No. 6287-1/9

12 3 4 5 6 7...9

中文翻译

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