是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | TSSOP |
包装说明: | VSSOP, TSOP6,.11,37 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.13 |
Is Samacsys: | N | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PDSO-G6 |
JESD-609代码: | e0 | 长度: | 2.9 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VSSOP |
封装等效代码: | TSOP6,.11,37 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 235 |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
最大供电电压 (Vsup): | 28 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 12 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 20 | 宽度: | 1.625 mm |
Base Number Matches: | 1 |
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