Datasheet > LQFPPOWERQUAD2

LQFPPOWERQUAD2

更新时间： 2024-11-20 03:24:43

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
2页	135K
描述
LQFP PowerQuad㈢ 2 Packages

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LQFPPOWERQUAD2 数据手册

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data sheet

LQFP

PowerQuad 2

High-performance operation and attributes of the LQFP

PowerQuad^®2 include the following:

Features:

• High conductive, solid exposed heatsink

• 1.4 mm body for lightweight, portable applications

• Direct die attach to heatsink

• 50% reduction in package self-inductance

• 50% improvement in θJa over standard LQFP

• 32 to 144 lead counts

• 7 x 7 - 20 x 20 mm body sizes

(JEDEC standard packages MS-026)

• Heatsink-up and down configurations available

LQFP PowerQuad 2

Packages:

LQFP PowerQuad^®2 (PQ2) is the same Amkor

patented, advanced IC packaging technology used

in plastic QFPs but applied to Low Profile 1.4 mm

QFPs (LQFP). This breakthrough in IC packaging

provides extraordinary gains in power dissipation

and speed through the use of innovative integrated,

embedded copper heatsink. The IC is attached

directly to the large, highly-efficient copper heatsink

which readily dissipates generated heat. To enhance

the thermal conduction from the IC to the mounting

surface, the LQFP PQ2 package leads are mechani-

cally connected, yet electrically isolated, to the

heatsink by a proprietary process. Thermal resist-

ance improvements greater than 55% are realized

with this technology and without the use of any

external cooling aids! The large heatsink also pro-

vides a “floating” ground plane to the signal leads

of the package thereby reducing self-inductance by

50% over conventional plastic LQFPs. In addition,

the patented LQFP PQ2 heatsink has integrated

mechanical “locking” features to ensure total pack-

age integrity and eliminates moisture penetration.

The end result is a high-power, high-speed IC

package with the properties to enable new, smaller,

denser, portable electronic products and emerging

end applications to move from concept to

Thermal Resistance:

Single-Layer PCB

Body

Pad

Theta JA (°C/W) by Velocity (LFPM)

Pkg Size (mm) Size (mm)

200 500

100 ld 14 x 14

208 ld 28 x 28

8.4

14.0

34.1 26.8 22.7

20.4 15.6 13.3

Multi-Layer PCB

Body

Pad

Theta JA (°C/W) by Velocity (LFPM)

Pkg Size(mm) Size (mm)

200 500

100 ld 14 x 14

208 ld 28 x 28

8.4

14.0

18.1 15.5 14.1

12.8 10.4 9.3

Pre-JEDEC Standard Test Boards

Advanced design, manufacturing processes and materials

assure long-term reliable performance.

Reliability:

• Temp cycle

• Thermal shock (liq)

• Autoclave

• Temp/Humidity

• High temp storage

-65/+150 °C, 1000 cycles

121 °C, 2 atm, 168 hours

85 °C/85%RH, 1000 hours

150 °C, 1000 hours

production.

Applications:

Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ2 as the IC package of choice for power microprocessors,

controllers, DSPs, high speed logic/FPGAs, PLDs, ASICs and other advanced technologies. System designers and OEM product developers find the

LQFP PQ2 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product

availability, technical support) in uses such as: laptops, notebooks, telecom, cordless/wireless, high-end audio/video, CPU/GUI board systems and

many other small form-factor applications.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

^{TO VIEW THE MOST CURRENT PRODUCT INFORMATION}.

DS170G

Rev Date: 05’06

www.amkor.com

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