Datasheet > LQFPPOWERQUAD4

LQFPPOWERQUAD4

更新时间： 2024-11-20 03:24:43

品牌	Logo	应用领域
AMKOR		/
页数	文件大小	规格书
2页	137K
描述
LQFP PowerQuad㈢ 4 Packages

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LQFPPOWERQUAD4 数据手册

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data sheet

LQFP

PowerQuad 4

High-performance operation and attributes of the LQFP

PowerQuad^®4 include the following:

Features:

• High conductive, solid exposed heatsink

• 1.4 mm body for lightweight, portable applications

• 50% reduction in package self-inductance

• 50% improvement in θJa over standard MQFP

• 44 to 128 lead counts

• 10 x 10 - 14 x 14 mm body sizes

(JEDEC standard packages MS-026)

• Heatsink-up and down configurations available

LQFP PowerQuad 4

Packages:

LQFP PowerQuad^®4 (PQ4) is the same Amkor

patented, advanced IC packaging technology used

in MQFP PQ4s but applied to Low Profile 1.4 mm

QFPs (LQFP). Improved power dissipation is

achieved by using an exposed copper heatslug. This

large copper heat slug extracts generated heat from

the leadframe to which the IC is attached. Thermal

resistance improvements of approximately 30%

(over a standard LQFP) can be realized with this IC

package without the use of any external cooling

aids! In addition, the patented LQFP PQ4 heatsink

has integrated mechanical “locking” features to

ensure total package integrity and eliminates mois-

ture penetration. The end result is a high-power,

high-speed IC package with the properties to enable

new, smaller, denser, portable electronic products

and emerging end applications to operate with

more features and greater reliability.

Thermal Resistance:

Multi-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Pkg Body Size Pad Size

64 ld 10 x 10

100 Id 14 x 14

200 500

7.5

9.5

34.8 28.9 26.4

23.2 12.8 15.8

Pre-JEDEC Standard Test Boards

Advanced design, manufacturing processes and materials

assure long-term reliable performance.

Reliability:

• Temp cycle

• Thermal shock (liq)

• Autoclave

• Temp/Humidity

• High temp storage

-65/+150 °C, 1000 cycles

121 °C, 2 atm, 168 hours

85 °C/85%RH, 1000 hours

150 °C, 1000 hours

Applications:

Major semiconductor manufacturers and packaging

engineers have chosen LQFP PQ4 as the IC package of

choice for power microprocessors, controllers, DSPs, high

speed logic/FPGAs, PLDs, ASICs and other advanced

technologies. System designers and OEM product

developers find the LQFP PQ4 solves power, thermal

and speed concerns while supporting system constraints

(standard package outlines, cost, SMT capability,

product availability, technical support) in uses such as:

laptops, notebooks, telecom, cordless/wireless, high-

end audio/video, CPU/GUI board systems and many

other small form-factor applications.

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

^{TO VIEW THE MOST CURRENT PRODUCT INFORMATION}.

DS576B

Rev Date: 05‘06

www.amkor.com

中文翻译

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与LQFPPOWERQUAD4相关器件

型号	品牌	获取价格	描述	数据表
LQG10A10NJ00	MURATA	获取价格	CHIP COIL
LQG10A10NJ00B1	MURATA	获取价格	General Purpose Inductor, 0.01uH, 5%, 1 Element, Air-Core, SMD
LQG10A10NJ00T1	MURATA	获取价格	General Purpose Inductor, 0.01uH, 5%, 1 Element, Air-Core, SMD,
LQG10A10NJ00T2	MURATA	获取价格	General Purpose Inductor, 0.01uH, 5%, 1 Element, SMD
LQG10A12NJ00	MURATA	获取价格	CHIP COIL
LQG10A12NJ00T2	MURATA	获取价格	General Purpose Inductor, 0.012uH, 5%, 1 Element, SMD
LQG10A15NJ00	MURATA	获取价格	CHIP COIL
LQG10A15NJ00T1	MURATA	获取价格	General Purpose Inductor, 0.015uH, 5%, 1 Element, Air-Core, SMD,
LQG10A18NJ00	MURATA	获取价格	CHIP COIL
LQG10A18NJ00T1	MURATA	获取价格	General Purpose Inductor, 0.018uH, 5%, 1 Element, Air-Core, SMD

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