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LQFPPOWERQUAD4 PDF预览

LQFPPOWERQUAD4

更新时间: 2024-11-05 03:24:43
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AMKOR /
页数 文件大小 规格书
2页 137K
描述
LQFP PowerQuad㈢ 4 Packages

LQFPPOWERQUAD4 数据手册

 浏览型号LQFPPOWERQUAD4的Datasheet PDF文件第2页 
LEADFRAME  
data sheet  
LQFP  
®
PowerQuad 4  
High-performance operation and attributes of the LQFP  
PowerQuad® 4 include the following:  
Features:  
• High conductive, solid exposed heatsink  
• 1.4 mm body for lightweight, portable applications  
• 50% reduction in package self-inductance  
• 50% improvement in θJa over standard MQFP  
• 44 to 128 lead counts  
• 10 x 10 - 14 x 14 mm body sizes  
(JEDEC standard packages MS-026)  
• Heatsink-up and down configurations available  
®
LQFP PowerQuad 4  
Packages:  
LQFP PowerQuad® 4 (PQ4) is the same Amkor  
patented, advanced IC packaging technology used  
in MQFP PQ4s but applied to Low Profile 1.4 mm  
QFPs (LQFP). Improved power dissipation is  
achieved by using an exposed copper heatslug. This  
large copper heat slug extracts generated heat from  
the leadframe to which the IC is attached. Thermal  
resistance improvements of approximately 30%  
(over a standard LQFP) can be realized with this IC  
package without the use of any external cooling  
aids! In addition, the patented LQFP PQ4 heatsink  
has integrated mechanical “locking” features to  
ensure total package integrity and eliminates mois-  
ture penetration. The end result is a high-power,  
high-speed IC package with the properties to enable  
new, smaller, denser, portable electronic products  
and emerging end applications to operate with  
more features and greater reliability.  
Thermal Resistance:  
Multi-Layer PCB  
Theta JA (°C/W) by Velocity (LFPM)  
Pkg Body Size Pad Size  
64 ld 10 x 10  
100 Id 14 x 14  
0
200 500  
7.5  
9.5  
34.8 28.9 26.4  
23.2 12.8 15.8  
Pre-JEDEC Standard Test Boards  
Advanced design, manufacturing processes and materials  
assure long-term reliable performance.  
Reliability:  
• Temp cycle  
• Thermal shock (liq)  
• Autoclave  
• Temp/Humidity  
• High temp storage  
-65/+150 °C, 1000 cycles  
-65/+150 °C, 1000 cycles  
121 °C, 2 atm, 168 hours  
85 °C/85%RH, 1000 hours  
150 °C, 1000 hours  
Applications:  
Major semiconductor manufacturers and packaging  
engineers have chosen LQFP PQ4 as the IC package of  
choice for power microprocessors, controllers, DSPs, high  
speed logic/FPGAs, PLDs, ASICs and other advanced  
technologies. System designers and OEM product  
developers find the LQFP PQ4 solves power, thermal  
and speed concerns while supporting system constraints  
(standard package outlines, cost, SMT capability,  
product availability, technical support) in uses such as:  
laptops, notebooks, telecom, cordless/wireless, high-  
end audio/video, CPU/GUI board systems and many  
other small form-factor applications.  
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND  
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.  
DS576B  
Rev Date: 05‘06  
www.amkor.com  

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