5秒后页面跳转
LPC18S30FET256E PDF预览

LPC18S30FET256E

更新时间: 2024-02-08 00:11:14
品牌 Logo 应用领域
恩智浦 - NXP PC静态存储器外围集成电路
页数 文件大小 规格书
151页 2921K
描述
LPC18S30FET256 - 32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS USB, EMC BGA 256-Pin

LPC18S30FET256E 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:,
针数:256Reach Compliance Code:compliant
风险等级:2.35湿度敏感等级:3
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

LPC18S30FET256E 数据手册

 浏览型号LPC18S30FET256E的Datasheet PDF文件第1页浏览型号LPC18S30FET256E的Datasheet PDF文件第2页浏览型号LPC18S30FET256E的Datasheet PDF文件第3页浏览型号LPC18S30FET256E的Datasheet PDF文件第5页浏览型号LPC18S30FET256E的Datasheet PDF文件第6页浏览型号LPC18S30FET256E的Datasheet PDF文件第7页 
LPC18S50/S30/S10  
NXP Semiconductors  
32-bit ARM Cortex-M3 microcontroller  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm  
LPC18S50FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls  
LPC18S30FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm  
Version  
LPC18S50FET256 LBGA256  
SOT740-2  
SOT570-3  
SOT740-2  
LPC18S30FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1  
LPC18S30FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1  
LPC18S10FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1  
LPC18S10FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1  
4.1 Ordering options  
Table 2.  
Ordering options  
Type number  
Total  
SRAM  
LCD Ethernet USB0  
(Host,  
USB1  
(Host,  
ADC  
channels  
PWM  
QEI  
GPIO Package  
Device, Device)/  
OTG)  
ULPI  
interface  
LPC18S50FET256  
LPC18S50FET180  
LPC1S830FET256  
LPC18S30FET100  
200 kB yes yes  
200 kB yes yes  
yes  
yes  
yes  
yes  
yes  
no  
yes/yes  
yes/yes  
yes/yes  
yes/no  
yes/no  
no  
8
8
8
4
8
4
8
yes  
yes  
yes  
no  
yes  
yes  
yes  
no  
164  
118  
164  
49  
LBGA256  
TFBGA180  
LBGA256  
TFBGA100  
LQFP144  
TFBGA100  
LQFP144  
200 kB no  
200 kB no  
yes  
yes  
yes  
no  
LPC18S30FBD144 200 kB no  
LPC18S10FET100 136 kB no  
yes  
no  
no  
83  
no  
49  
LPC18S10FBD144 136 kB no  
no  
no  
no  
yes  
no  
83  
LPC18S50_S30_S10  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 1.2 — 8 March 2016  
4 of 151  
 
 
 

与LPC18S30FET256E相关器件

型号 品牌 描述 获取价格 数据表
LPC18S37JBD144 NXP 32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB,

获取价格

LPC18S37JET100 NXP 32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB,

获取价格

LPC18S3X NXP 32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB,

获取价格

LPC18S50 NXP 32-bit ARM Cortex-M3 flashless MCU with security features

获取价格

LPC18S50FET180 NXP 32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS U

获取价格

LPC18S50FET256 NXP 32-bit ARM Cortex-M3 flashless MCU with security features; 200 kB SRAM; Ethernet, two HS U

获取价格