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LMK107SD223KA-T PDF预览

LMK107SD223KA-T

更新时间: 2024-01-10 17:43:49
品牌 Logo 应用领域
太诱 - TAIYO YUDEN 电容器
页数 文件大小 规格书
20页 850K
描述
Capacitor, Ceramic, Chip, General Purpose, 0.022uF, 10V, ±10%, SD, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch

LMK107SD223KA-T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:0603
包装说明:CHIPReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8532.24.00.20
风险等级:2.08电容:0.022 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.8 mm长度:1.6 mm
安装特点:SURFACE MOUNT多层:Yes
负容差:10%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE封装形式:SMT
包装方法:TAPE, PAPER正容差:10%
额定(直流)电压(URdc):10 V尺寸代码:0603
表面贴装:YES温度特性代码:SD
端子形状:WRAPAROUND宽度:0.8 mm
Base Number Matches:1

LMK107SD223KA-T 数据手册

 浏览型号LMK107SD223KA-T的Datasheet PDF文件第3页浏览型号LMK107SD223KA-T的Datasheet PDF文件第4页浏览型号LMK107SD223KA-T的Datasheet PDF文件第5页浏览型号LMK107SD223KA-T的Datasheet PDF文件第7页浏览型号LMK107SD223KA-T的Datasheet PDF文件第8页浏览型号LMK107SD223KA-T的Datasheet PDF文件第9页 
Multilayer Ceramic Capacitors  
PACKAGING  
①Minimum Quantity  
Taped package  
Thickness  
Standard quantity [pcs]  
Type(EIA)  
mm  
code  
K
Paper tape  
Embossed tape  
□MK021(008004)  
□VS021(008004)  
□MK042(01005)  
□VS042(01005)  
□MK063(0201)  
0.125  
50000  
0.2  
0.2  
C, D  
C
P,T  
P
40000  
0.3  
15000  
10000  
□WK105(0204) ※  
0.3  
0.13  
0.18  
0.2  
H
E
20000  
15000  
□MK105(0402)  
□MF105(0402)  
C
P
20000  
15000  
10000  
10000  
4000  
0.3  
0.5  
V
W
K
□VK105(0402)  
□MK107(0603)  
□WK107(0306) ※  
□MF107(0603)  
□VS107(0603)  
□MJ107(0603)  
0.5  
0.45  
0.5  
V
A
C
A
K
4000  
0.8  
4000  
4000  
3000  
0.7  
0.8  
3000  
0.45  
0.85  
1.25  
0.85  
0.85  
1.25  
0.85  
1.15  
1.6  
□MK212(0805)  
4000  
□WK212(0508)  
□MF212(0805)  
D
G
D
D
G
D
F
4000  
4000  
3000  
□VS212(0805)  
□MJ212(0805)  
2000  
4000  
□MK316(1206)  
□MF316(1206)  
3000  
2000  
3000  
2000  
L
1.15  
1.6  
F
□MJ316(1206)  
L
0.85  
1.15  
1.9  
D
F
2000  
□MK325(1210)  
□MF325(1210)  
N
Y
2.0max.  
2.5  
M
N
M
M
1000  
2000  
1.9  
□MJ325(1210)  
□MK432(1812)  
2.5  
500(T), 1000(P)  
500  
2.5  
Note : ※ LW Reverse type.  
②Taping material  
※No bottom tape for pressed carrier tape  
Card board carrier tape  
Embossed tape  
Top tape  
Top tape  
Base tape  
Sprocket hole  
Chip cavity  
Sprocket hole  
Chip cavity  
Bottom tape  
Base tape  
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.  
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .  
c_mlcc_pack_e-E06R01  

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