是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOT-23 |
包装说明: | LSSOP, TSOP5/6,.11,37 | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.16 | 放大器类型: | OPERATIONAL AMPLIFIER |
架构: | VOLTAGE-FEEDBACK | 最大平均偏置电流 (IIB): | 25 µA |
标称带宽 (3dB): | 90 MHz | 25C 时的最大偏置电流 (IIB): | 20 µA |
最小共模抑制比: | 87 dB | 标称共模抑制比: | 95 dB |
频率补偿: | YES | 最大输入失调电流 (IIO): | 1.5 µA |
最大输入失调电压: | 500 µV | JESD-30 代码: | R-PDSO-G5 |
JESD-609代码: | e3 | 长度: | 2.9 mm |
低-偏置: | NO | 低-失调: | YES |
微功率: | NO | 湿度敏感等级: | 1 |
负供电电压上限: | -6.6 V | 标称负供电电压 (Vsup): | -2.5 V |
功能数量: | 1 | 端子数量: | 5 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LSSOP |
封装等效代码: | TSOP5/6,.11,37 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 包装方法: | TR |
峰值回流温度(摄氏度): | 260 | 功率: | NO |
电源: | +-2.5/+-6/+5/+12 V | 可编程功率: | NO |
认证状态: | Not Qualified | 座面最大高度: | 1.45 mm |
标称压摆率: | 400 V/us | 子类别: | Operational Amplifier |
最大压摆率: | 16 mA | 供电电压上限: | 6.6 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | BIPOLAR | 温度等级: | AUTOMOTIVE |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 标称均一增益带宽: | 1800000 kHz |
最小电压增益: | 3160 | 宽带: | YES |
宽度: | 1.6 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
LMH6624MF/NOPB | TI |
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