LMH0318
ZHCSE54 –SEPTEMBER 2015
www.ti.com.cn
目录
8.4 Device Functional Modes........................................ 24
8.5 Programming .......................................................... 24
Application and Implementation ........................ 43
9.1 Application Information............................................ 43
9.2 Typical Application ................................................. 43
9.3 Do's and Don'ts....................................................... 48
9.4 Initialization Set Up ................................................. 48
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明（续）............................................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 6
7.5 Electrical Characteristics........................................... 7
9
10 Power Supply Recommendations ..................... 48
11 Layout................................................................... 49
11.1 Layout Guidelines ................................................. 49
11.2 Layout Example .................................................... 49
11.3 Solder Profile......................................................... 50
12 器件和文档支持 ..................................................... 51
12.1 器件支持................................................................ 51
12.2 文档支持................................................................ 51
12.3 社区资源................................................................ 51
12.4 商标....................................................................... 51
12.5 静电放电警告......................................................... 51
12.6 Glossary................................................................ 51
13 机械封装和可订购信息 .......................................... 51
7.6 Recommended SMBus Interface AC Timing
Specifications........................................................... 11
7.7 Serial Parallel Interface (SPI) Bus Interface AC
Timing Specifications ............................................... 11
7.8 Typical Characteristics............................................ 12
Detailed Description ............................................ 13
8.1 Overview ................................................................. 13
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 14
8
4 修订历史记录
日期
修订版本
注释
2015 年 9 月
*
首次发布。
2
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