Datasheet > LLDB3TG-L1

LLDB3TG-L1

更新时间： 2024-11-23 12:20:27

品牌	Logo	应用领域
TSC		二极管双向触发二极管
页数	文件大小	规格书
3页	200K
描述
150mW Bi-directional Trigger Diode

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中文翻译

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数据手册

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LLDB3TG-L1 数据手册

LLDB3-LLDB3TG

150mW Bi-directional Trigger Diode

Small Signal Diode

MINI-MELF (LL34)

HERMETICALLY SEALED GLASS

Features

Surface device type mounting.

Hermetically Sealed Glass.

Matte Tin (Sn) Terminal Finish

Pb free version and RoHS compliant

All external surfaces are corrosion resistant and

terminals are readily solderable.

Unit (mm)

Unit (inch)

Min Max

Dimensions

Min

3.30

1.40

Max

3.70

1.60

Mechanical Data

Case :MINI-MELF Package

0.130 0.146

0.055 0.063

Terminal: Pure tin plated, lead free., solderable

per MIL-STD-202, Method 208 guaranteed

0.20

0.50

0.008 0.020

High temperature soldering guaranteed: 260°C/10s

Weight : 29 ± 2.5 mg

Suggested PAD Layout

Ordering Information

1.25

0.049

Part No.

LLDB3 L1

LLDB3TG L1

Packing

Package

MINI-MELF

2.5K / 7" Reel

2.00

2.50

0.079

0.098

Maximum Ratings and Electrical Characteristics

Rating at 25°C ambient temperature unless otherwise specified.

5.00

0.197

Maximum Ratings

Type Number

Symbol

Value

Units

Power Dissipation

P^D

150

Pulse Width=

Repetitive Peak Forward Current

I^FRM

20μsec

Thermal Resistance (Junction to Ambient) (Note 1)

Junction and Storage Temperature Range

RθJA

400

°C/W

°C

T^J, TSTG

-40 to + 125

Notes:1. Valid provided that electrodes are kept at ambient temperature

Version : C10

12 3

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