Datasheet > LAIC66A1U

LAIC66A1U

更新时间： 2024-10-19 03:50:23

品牌	Logo	应用领域
西迪斯 - CTS		半导体
页数	文件大小	规格书
2页	87K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

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LAIC66A1U 数据手册

Series LA-A1

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

Part Number Series LA-A1

Natural Conv. (°C/W): 28.9

Forced Air (°C/W): 8.1

Mounting Envelope: 1.31" x .90" x .25"

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.

Derate 0.3 °C/watt for unplated part in natural convection only.

Derate 0.8 °C/watt for Insulubeꢀ part in natural convection only.

Ordering Information

CTS IERC PART NO.

Semiconductor

Accommodated

Hole patt. ref. no.

Max. Weight

(Grams)

Unplated

LA000A1U

LAD66A1U

LAIC66A1U

Comm'l. Black

Anodize

Mil. Black Anodize

LA000A1CB

LAD66A1CB

LAIC66A1CB

LA000A1B

LAD66A1B

LAIC66A1B

Undrilled

TO-66

TO-66IC

3.1

1 (see below)

7 (see below)

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