Datasheet > LAIC66A2CB

LAIC66A2CB

更新时间： 2024-10-19 03:50:23

品牌	Logo	应用领域
西迪斯 - CTS		半导体
页数	文件大小	规格书
2页	152K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

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LAIC66A2CB 数据手册

Series LA-A2

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

Part Number Series LA-A2

Natural Conv. (°C/W): 19.7

Forced Air (°C/W): 6.4

Mounting Envelope: 1.31" x .90" x .25"

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.

Derate 0.4 °C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

Unplated

Comm'l. Black

Anodize

Mil. Black

Anodize

LA000A2U

LAD66A2U

LAIC66A2U

LA000A2CB

LAD66A2CB

LAIC66A2CB

LA000A2B

LAD66A2B

LAIC66A2B

Undrilled

TO-66

TO-66 IC

4.6

1 (see below)

7 (see below)

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