是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP2 | 包装说明: | TSOP2, TSOP44,.46,32 |
针数: | 44 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.71 |
风险等级: | 5.92 | 最长访问时间: | 120 ns |
其他特性: | CONFIGURABLE AS 2M X 16 | 备用内存宽度: | 8 |
JESD-30 代码: | R-PDSO-G44 | JESD-609代码: | e0 |
长度: | 18.41 mm | 内存密度: | 33554432 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 44 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 2MX16 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP2 |
封装等效代码: | TSOP44,.46,32 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 并行/串行: | PARALLEL |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大待机电流: | 0.00005 A |
子类别: | MASK ROMs | 最大压摆率: | 0.15 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.8 mm | 端子位置: | DUAL |
宽度: | 10.16 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KM23C32100FP-20 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 200ns, CMOS, PQFP64, QFP-64 | |
KM23C32120A-12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | |
KM23C32120C-12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | |
KM23C32120C-15 | SAMSUNG |
获取价格 |
MASK ROM, 4MX8, 150ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | |
KM23C4000-20 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23C4000A-12 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23C4000A-20 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23C4000B-10 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 100ns, CMOS, PDIP32, DIP-32 | |
KM23C4000B-12 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | |
KM23C4000BG-10 | SAMSUNG |
获取价格 |
MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 0.450 INCH, SOP-32 |