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KF2N60D

更新时间: 2024-09-30 11:29:35
品牌 Logo 应用领域
KEC /
页数 文件大小 规格书
6页 406K
描述
N CHANNEL MOS FIELD EFFECT TRANSISTOR

KF2N60D 技术参数

生命周期:Active包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
风险等级:5.67雪崩能效等级(Eas):60 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):1.9 A最大漏极电流 (ID):1.9 A
最大漏源导通电阻:4.4 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):40.3 W
最大脉冲漏极电流 (IDM):4 A子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

KF2N60D 数据手册

 浏览型号KF2N60D的Datasheet PDF文件第2页浏览型号KF2N60D的Datasheet PDF文件第3页浏览型号KF2N60D的Datasheet PDF文件第4页浏览型号KF2N60D的Datasheet PDF文件第5页浏览型号KF2N60D的Datasheet PDF文件第6页 
KF2N60D/I  
SEMICONDUCTOR  
N CHANNEL MOS FIELD  
EFFECT TRANSISTOR  
TECHNICAL DATA  
General Description  
KF2N60D  
This planar stripe MOSFET has better characteristics, such as fast  
switching time, low on resistance, low gate charge and excellent  
avalanche characteristics. It is mainly suitable for switching mode  
power supplies.  
A
C
K
DIM MILLIMETERS  
L
D
B
_
6.60 + 0.20  
A
B
C
D
E
_
6.10+0.20  
_
5.34 + 0.30  
_
0.70+0.20  
_
2.70 + 0.15  
FEATURES  
_
2.30+0.10  
F
0.96 MAX  
0.90 MAX  
G
H
J
· VDSS= 600V, ID= 1.9A  
· RDS(ON)=4.4(Max) @VGS = 10V  
· Qg(typ) = 6.0nC  
H
J
_
1.80+0.20  
E
_
2.30+0.10  
K
L
G
N
_
0.50 + 0.10  
_
0.50+0.10  
F
F
M
M
N
0.70 MIN  
MAXIMUM RATING (Tc=25)  
1
2
3
1. GATE  
2. DRAIN  
3. SOURCE  
CHARACTERISTIC  
Drain-Source Voltage  
Gate-Source Voltage  
@TC=25℃  
SYMBOL  
VDSS  
RATING  
600  
UNIT  
V
VGSS  
V
±30  
1.9  
ID  
DPAK (1)  
Drain Current  
@TC=100℃  
1.2  
A
IDP  
Pulsed (Note1)  
4.0  
Single Pulsed Avalanche Energy  
(Note 2)  
KF2N60I  
EAS  
60  
2.3  
4.5  
mJ  
mJ  
A
C
H
Repetitive Avalanche Energy  
(Note 1)  
EAR  
J
Peak Diode Recovery dv/dt  
(Note 3)  
dv/dt  
V/ns  
DIM MILLIMETERS  
_
40.3  
0.32  
W
W/℃  
Tc=25℃  
A
B
C
D
E
F
6.6 0.2  
+
Drain Power  
Dissipation  
PD  
_
6.1 0.2  
+
M
Derate above 25℃  
_
5.34 0.3  
+
P
_
0.7 0.2  
+
N
Tj  
Maximum Junction Temperature  
Storage Temperature Range  
150  
_
9.3 0.3  
+
_
2.3 0.2  
+
Tstg  
-55150  
_
0.76 0.1  
G
H
J
+
G
_
2.3 0.1  
+
Thermal Characteristics  
_
L
0.5 0.1  
+
F
F
RthJC  
RthJA  
Thermal Resistance, Junction-to-Case  
3.1  
_
/W  
/W  
K
L
M
N
P
1.8 0.2  
+
_
+
0.5  
0.1  
Thermal Resistance, Junction-to-  
Ambient  
_
1.0 0.1  
+
110  
0.96 MAX  
_
1
2
3
1.02 0.3  
+
1. GATE  
2. DRAIN  
3. SOURCE  
PIN CONNECTION  
(KF2N60D/I)  
IPAK(1)  
D
G
S
2011. 3. 23  
Revision No : 0  
1/6  

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