生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | FBGA-63 | 针数: | 63 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.79 |
最长访问时间: | 40 ns | JESD-30 代码: | R-PBGA-B63 |
长度: | 16 mm | 内存密度: | 268435456 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 63 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 16MX16 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
并行/串行: | PARALLEL | 编程电压: | 1.8 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 类型: | SLC NAND TYPE |
宽度: | 8.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9K1G16U0A | SAMSUNG |
获取价格 |
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory | |
K9K1G16U0A-GIB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, FBGA-63 | |
K9K1G16U0A-JCB0 | SAMSUNG |
获取价格 |
Flash, 64MX16, 30ns, PBGA63, | |
K9K1G16U0A-JCB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, LEAD FREE, FBGA-63 | |
K9K1G16U0A-JIB0 | SAMSUNG |
获取价格 |
Flash, 64MX16, 30ns, PBGA63, | |
K9K1G16U0A-JIB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PBGA63, LEAD FREE, FBGA-63 | |
K9K1G16U0A-PCB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9K1G16U0A-PIB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9K1G16U0A-YCB0 | SAMSUNG |
获取价格 |
Flash, 64MX16, 30ns, PDSO48, | |
K9K1G16U0A-YCB00 | SAMSUNG |
获取价格 |
Flash, 16MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 |