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K9K1G16U0A-YCB0 PDF预览

K9K1G16U0A-YCB0

更新时间: 2024-12-01 14:51:51
品牌 Logo 应用领域
三星 - SAMSUNG 光电二极管内存集成电路
页数 文件大小 规格书
44页 918K
描述
Flash, 64MX16, 30ns, PDSO48,

K9K1G16U0A-YCB0 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP, TSSOP48,.8,20Reach Compliance Code:compliant
风险等级:5.92最长访问时间:30 ns
命令用户界面:YES数据轮询:NO
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
内存密度:1073741824 bit内存集成电路类型:FLASH
内存宽度:16部门数/规模:8K
端子数量:48字数:67108864 words
字数代码:64000000最高工作温度:70 °C
最低工作温度:组织:64MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH页面大小:256 words
并行/串行:PARALLEL电源:3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.03 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
切换位:NO类型:NAND TYPE
Base Number Matches:1

K9K1G16U0A-YCB0 数据手册

 浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第2页浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第3页浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第4页浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第5页浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第6页浏览型号K9K1G16U0A-YCB0的Datasheet PDF文件第7页 
Preliminary  
FLASH MEMORY  
K9K1G08Q0A  
K9K1G08U0A K9K1G16U0A  
Document Title  
128M x 8 Bit / 64M x 16 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial issue.  
Mar. 17th 2003 Advance  
0.1  
1. Note is added.  
Jun. 4th 2003  
Aug. 1st 2003  
Oct. 14th 2003  
Preliminary  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
2. 63FBGA,1.8V product is added.  
K9K1G08Q0A-GCB0,GIB0,JCB0,JIB0  
Errata is deleted.  
AC parameters are changed.  
Preliminary  
Preliminary  
0.2  
0.3  
tWC tWH tWP tRC tREH tRP tREA tCEA  
Before 45 15 25 50 15 25 30  
After 60 20 40 60 20 40 40  
45  
55  
1. K9K1G16Q0A-DC(I)B0 is deleted.  
2. AC parameters are changed.  
tWC tWH tWP tRC tREH tRP tREA tCEA  
K9K1GXXU0A 50 15 25 50 15 25 30  
45  
K9K1GXXD0A  
K9K1G08Q0A 60 20 40 60 20 40 40  
55  
0.4  
0.5  
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.  
Preliminary  
Preliminary  
Apr. 23th 2004  
May 21th 2004  
1. PKG(TSOP1, WSOP1) Dimension Change  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the  
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you  
have any questions, please contact the SAMSUNG branch office near your office.  
1

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K9K2G08Q0M-PIB00 SAMSUNG

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K9K2G08Q0M-Y SAMSUNG

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K9K2G08Q0M-YCB0 SAMSUNG

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256M x 8 Bit / 128M x 16 Bit NAND Flash Memory
K9K2G08Q0M-YCB00 SAMSUNG

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Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48