K8S2815ET(B)C
NOR FLASH MEMORY
128M Bit (8M x16) Muxed Burst , Multi Bank NOR Flash Memory
1.1 GENERAL DESCRIPTION
1.0 FEATURES
The K8S2815E featuring single 1.8V power supply is a 128Mbit Syn-
chronous Burst Multi Bank Flash Memory organized as 8Mx16. The
memory architecture of the device is designed to divide its memory
arrays into 263 blocks with independent hardware protection. This
block architecture provides highly flexible erase and program capabil-
ity. The K8S2815E NOR Flash consists of sixteen banks. This device
is capable of reading data from one bank while programming or eras-
ing in the other bank.
• Single Voltage, 1.7V to 1.95V for Read and Write operations
• Organization
- 8,386,108 x 16 bit ( Word Mode Only)
• Multiplexed Data and Address for reduction of interconnections
- A/DQ0 ~ A/DQ15
• Read While Program/Erase Operation
• Multiple Bank Architecture
- 16 Banks (8Mb Partition)
Regarding read access time, the K8S2815E provides an 14.5ns
burst access time and an 70ns initial access time at 54MHz. At
66MHz, the K8S2815E provides an 11ns burst access time and 70ns
initial access time. At 83MHz, the K8S2815E provides an 9ns burst
access time and 70ns initial access time. At 108MHz, the K8S2815E
provides an 7ns burst access time and 70ns initial access time. The
device performs a program operation in units of 16 bits (Word) and an
erase operation in units of a block. Single or multiple blocks can be
erased. The block erase operation is completed within typically
0.7sec. The device requires 15mA as program/erase current in the
extended temperature ranges.
• OTP Block : Extra 256-word block
• Read Access Time (@ CL=30pF)
- Asynchronous Random Access Time : 70ns
- Synchronous Random Access Time : 70ns
- Burst Access Time :
14.5ns (54MHz) / 11ns (66MHz) / 9ns (83Mhz) / 7ns (108Mhz)
• Burst Length :
- Continuous Linear Burst
- Linear Burst : 8-word & 16-word with Wrap
• Block Architecture
- Eight 4Kword blocks and two hundreds fifty-five 32Kword blocks
The K8S2815E NOR Flash Memory is created by using Samsung's
advanced CMOS process technology.
- Bank 0 contains eight 4 Kword blocks and fifteen 32Kword blocks
- Bank 1 ~ Bank 15 contain two hundred forty 32Kword blocks
• Reduce program time using the VPP
• Support Single & Quad word accelerate program
• Power Consumption (Typical value, CL=30pF)
- Burst Access Current : 24mA
- Program/Erase Current : 15mA
- Read While Program/Erase Current : 40mA
- Standby Mode/Auto Sleep Mode : 15uA
• Block Protection/Unprotection
- Using the software command sequence
- Last two boot blocks are protected by WP=VIL
- All blocks are protected by VPP=VIL
• Handshaking Feature
- Provides host system with minimum latency by monitoring
RDY
• Erase Suspend/Resume
• Program Suspend/Resume
• Unlock Bypass Program/Erase
• Hardware Reset (RESET)
• Data Polling and Toggle Bits
- Provides a software method of detecting the status of program
or erase completion
• Endurance
- 100K Program / Erase cycles
• Extended Temperature : -25°C ~ 85°C
• Support Common Flash Memory Interface
• Low Vcc Write Inhibit
• Package : Package : 44-ball FBGA Type, 7.7 x 6.2mm
0.5 mm ball pitch
1.0 mm (Max.) Thickness
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
2
Revision 1.2
November 2008