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K8S2715EBC-SE7E0 PDF预览

K8S2715EBC-SE7E0

更新时间: 2024-02-07 05:15:23
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
60页 1114K
描述
Flash, PBGA44, 7.70 X 6.20 MM, 0.50 MM PITCH, LEAD FREE, FBGA-44

K8S2715EBC-SE7E0 技术参数

生命周期:Active零件包装代码:BGA
包装说明:,针数:44
Reach Compliance Code:compliant风险等级:5.66
JESD-30 代码:R-PBGA-B44内存集成电路类型:FLASH
端子数量:44封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:GRID ARRAY
编程电压:1.8 V表面贴装:YES
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

K8S2715EBC-SE7E0 数据手册

 浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第3页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第4页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第5页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第7页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第8页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第9页 
K8S2815ET(B)C  
NOR FLASH MEMORY  
1.2 PIN DESCRIPTION  
Pin Name  
A16 - A22  
A/DQ0 - A/DQ15  
CE  
Pin Function  
Address Inputs  
Multiplexed Address/Data input/output  
Chip Enable  
OE  
Output Enable  
RESET  
Hardware Reset Pin  
Accelerates Programming  
VPP  
WE  
WP  
Write Enable  
Hardware Write Protection Input  
Clock  
CLK  
RDY  
AVD  
VCC  
Ready Output  
Address Valid Input  
Power Supply  
VSS  
Ground  
3
Revision 1.2  
November 2008  

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