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K8S2715EBC-SE7E0 PDF预览

K8S2715EBC-SE7E0

更新时间: 2024-01-12 13:35:40
品牌 Logo 应用领域
三星 - SAMSUNG 内存集成电路
页数 文件大小 规格书
60页 1114K
描述
Flash, PBGA44, 7.70 X 6.20 MM, 0.50 MM PITCH, LEAD FREE, FBGA-44

K8S2715EBC-SE7E0 技术参数

生命周期:Active零件包装代码:BGA
包装说明:,针数:44
Reach Compliance Code:compliant风险等级:5.66
JESD-30 代码:R-PBGA-B44内存集成电路类型:FLASH
端子数量:44封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:GRID ARRAY
编程电压:1.8 V表面贴装:YES
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

K8S2715EBC-SE7E0 数据手册

 浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第1页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第2页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第3页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第5页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第6页浏览型号K8S2715EBC-SE7E0的Datasheet PDF文件第7页 
K8S2815ET(B)C  
NOR FLASH MEMORY  
128Mb C-die SLC NOR Specification 1  
1. 0 FEATURES................................................................................................................................................................2  
1.1. GENERAL DESCRIPTION .....................................................................................................................................2  
1.2. PIN DESCRIPTION.................................................................................................................................................3  
1.3. 44Ball FBGA TOP VIEW (BALL DOWN) ................................................................................................................4  
1.4. FUNCTIONAL BLOCK DIAGRAM ..........................................................................................................................5  
2. 0 Ordering Information ..................................................................................................................................................6  
3. 0 PRODUCT INTRODUCTION.....................................................................................................................................8  
4. 0 COMMAND DEFINITIONS ........................................................................................................................................9  
4.1. COMMAND DEFINITIONS .....................................................................................................................................9  
5. 0 DEVICE OPERATION................................................................................................................................................11  
5.1. Read Mode..............................................................................................................................................................11  
5.2. Asynchronous Read Mode......................................................................................................................................11  
5.3. Synchronous (Burst) Read Mode............................................................................................................................11  
5.4. Output Driver Setting...............................................................................................................................................12  
5.5. Programmable Wait State.......................................................................................................................................12  
5.6. Set Burst Mode Configuration Register...................................................................................................................12  
5.6.1  
Extended Configuration Register (option : K8S2615ET(B)C, K8S2915ET(B)C only) ........................................13  
5.7. Programmable Wait State Configuration.................................................................................................................13  
5.8. Burst Read Mode Setting........................................................................................................................................13  
5.9. RDY Configuration ..................................................................................................................................................13  
5.10. Autoselect Mode ...................................................................................................................................................13  
5.11. Standby Mode.......................................................................................................................................................14  
5.12. Automatic Sleep Mode..........................................................................................................................................14  
5.13. Output Disable Mode ............................................................................................................................................14  
5.14. Block Protection & Unprotection ...........................................................................................................................14  
5.14.1 Enhanced Block Protection (option : K8S2715ET(B)C, K8S2915ET(B)C only) .................................................14  
5.15. Hardware Reset ....................................................................................................................................................19  
5.16. Software Reset......................................................................................................................................................19  
5.17. Program ................................................................................................................................................................19  
5.18. Accelerated Program Operation............................................................................................................................19  
5.19. Unlock Bypass ......................................................................................................................................................20  
5.20. Chip Erase ............................................................................................................................................................20  
5.21. Block Erase...........................................................................................................................................................20  
5.22. Erase Suspend / Resume .....................................................................................................................................20  
5.23. Program Suspend / Resume.................................................................................................................................21  
5.24. Read While Write Operation .................................................................................................................................21  
5.25. OTP Block Region.................................................................................................................................................21  
5.26. Write Pulse “Glitch” Protection..............................................................................................................................21  
5.27. Low VCC Write Inhibit...........................................................................................................................................22  
5.28. Logical Inhibit ........................................................................................................................................................22  
5.29. Power-up Protection..............................................................................................................................................22  
5.30. FLASH MEMORY STATUS FLAGS .....................................................................................................................22  
6. 0 Commom Flash Memory Interface.............................................................................................................................24  
7. 0 ABSOLUTE MAXIMUM RATINGS.......................................................................................................................26  
8. 0 DC CHARACTERISTICS ....................................................................................................................................26  
9. 0 CAPACITANCE..........................................................................................................................................................28  
10. 0 AC TEST CONDITION......................................................................................................................................28  
10.1. Asynchronous Read....................................................................................................................................... 31  
10.2. Hardware Reset(RESET) ............................................................................................................................... 34  
10.3. Erase/Program Operation............................................................................................................................... 35  
11. 0 FLASH Erase/Program Performance ................................................................................................................35  
1
Revision 1.2  
November 2008  

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