生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 119 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.78 |
最长访问时间: | 2 ns | 其他特性: | PIPELINED ARCHITECTURE |
JESD-30 代码: | R-PBGA-B119 | 长度: | 22 mm |
内存密度: | 9437184 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 18 | 功能数量: | 1 |
端子数量: | 119 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 512KX18 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 最大供电电压 (Vsup): | 3.45 V |
最小供电电压 (Vsup): | 3.15 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K7P801822B-HC16 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 3ns, CMOS, PBGA153, 14 X 22 MM, BGA-153 | |
K7P801866B | SAMSUNG |
获取价格 |
256Kx36 AND 512Kx18 Synchronous Pipelined SRAM | |
K7P801866B-HC250 | SAMSUNG |
获取价格 |
Late-Write SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866B-HC300 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 1.6ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-H20 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-H2000 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-H21 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-H2100 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-H2500 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | |
K7P801866M-HC210 | SAMSUNG |
获取价格 |
Standard SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 |