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K7P801866B-HC250 PDF预览

K7P801866B-HC250

更新时间: 2024-11-12 05:44:27
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器
页数 文件大小 规格书
13页 305K
描述
Late-Write SRAM, 512KX18, 2ns, CMOS, PBGA119, 14 X 22 MM, BGA-119

K7P801866B-HC250 数据手册

 浏览型号K7P801866B-HC250的Datasheet PDF文件第2页浏览型号K7P801866B-HC250的Datasheet PDF文件第3页浏览型号K7P801866B-HC250的Datasheet PDF文件第4页浏览型号K7P801866B-HC250的Datasheet PDF文件第5页浏览型号K7P801866B-HC250的Datasheet PDF文件第6页浏览型号K7P801866B-HC250的Datasheet PDF文件第7页 
K7P803666B  
K7P801866B  
256Kx36 & 512Kx18 SRAM  
Document Title  
256Kx36 & 512Kx18 Synchronous Pipelined SRAM  
Revision History  
Rev. No.  
History  
Draft Date  
Remark  
Rev. 0.0  
- Initial Document.  
June. 2000  
Advance  
Rev. 0.1  
Rev. 0.2  
Rev. 0.3  
- ZQ tolerance changed from 10% to 15%  
Aug. 2000  
Dec. 2000  
Feb. 2001  
Advance  
Advance  
Preliminary  
- VDDQ changed to support wide range from 1.4V to 2.0V  
- Functional Block diagram changed.  
- Absolute Maximum ratings VDDQ changed from 3.13V to 2.825V  
- Recommended DC Operating Conditions for VREF and VCM-CLK changed  
from Min 0.6V to 0.68V, from Max 0.9V to 1.0V  
Rev. 1.0  
Rev. 2.0  
Rev. 3.0  
- Package thermal characteristics added.  
May. 2001  
Jan. 2002  
Mar. 2002  
Final  
Final  
Final  
- Absolute Maximum Rating VDDQ changed from 2.825V to 2.4V  
- Function Description modified  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the  
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters  
of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.  
March. 2002  
- 1 -  
Rev 3.0  

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