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K7J643682M-FI250 PDF预览

K7J643682M-FI250

更新时间: 2024-02-09 05:32:38
品牌 Logo 应用领域
三星 - SAMSUNG 时钟双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
18页 429K
描述
DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165

K7J643682M-FI250 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92Is Samacsys:N
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):250 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:17 mm内存密度:75497472 bit
内存集成电路类型:DDR SRAM内存宽度:36
功能数量:1端子数量:165
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:2MX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:1.5/1.8,1.8 V认证状态:Not Qualified
座面最大高度:1.4 mm最小待机电流:1.7 V
子类别:SRAMs最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:15 mmBase Number Matches:1

K7J643682M-FI250 数据手册

 浏览型号K7J643682M-FI250的Datasheet PDF文件第2页浏览型号K7J643682M-FI250的Datasheet PDF文件第3页浏览型号K7J643682M-FI250的Datasheet PDF文件第4页浏览型号K7J643682M-FI250的Datasheet PDF文件第5页浏览型号K7J643682M-FI250的Datasheet PDF文件第6页浏览型号K7J643682M-FI250的Datasheet PDF文件第7页 
K7J643682M  
K7J641882M  
2Mx36 & 4Mx18 DDR II SIO b2 SRAM  
72Mb DDRII SRAM Specification  
165 FBGA with Pb & Pb-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.  
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-  
lar applications where Product failure could result in loss of life or personal or physical harm, or any military  
or defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.3 March 2007  
- 1 -  

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