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K7A801800A-HC15 PDF预览

K7A801800A-HC15

更新时间: 2024-11-16 15:46:27
品牌 Logo 应用领域
三星 - SAMSUNG 时钟静态存储器内存集成电路
页数 文件大小 规格书
20页 537K
描述
Cache SRAM, 512KX18, 3.8ns, CMOS, PBGA119, BGA-119

K7A801800A-HC15 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:3.8 ns
其他特性:SELF-TIMED WRITE CYCLE最大时钟频率 (fCLK):149 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B119
JESD-609代码:e0长度:22 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:18功能数量:1
端子数量:119字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5/3.3,3.3 V
认证状态:Not Qualified最大待机电流:0.05 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.41 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

K7A801800A-HC15 数据手册

 浏览型号K7A801800A-HC15的Datasheet PDF文件第2页浏览型号K7A801800A-HC15的Datasheet PDF文件第3页浏览型号K7A801800A-HC15的Datasheet PDF文件第4页浏览型号K7A801800A-HC15的Datasheet PDF文件第5页浏览型号K7A801800A-HC15的Datasheet PDF文件第6页浏览型号K7A801800A-HC15的Datasheet PDF文件第7页 
K7A803600A  
K7A801800A  
256Kx36 & 512Kx18 Synchronous SRAM  
Document Title  
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM  
Revision History  
Rev. No.  
History  
Draft Date  
May. 24 . 2000 Preliminary  
July. 03. 2000 Final  
Remark  
0.0  
1.0  
Initial draft  
1. Final spec Release.  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
- 1 -  
July 2000  
Rev 1.0  

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