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K6R1016V1B-JP12 PDF预览

K6R1016V1B-JP12

更新时间: 2023-06-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管
页数 文件大小 规格书
9页 207K
描述
Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, PLASTIC, SOJ-44

K6R1016V1B-JP12 数据手册

 浏览型号K6R1016V1B-JP12的Datasheet PDF文件第1页浏览型号K6R1016V1B-JP12的Datasheet PDF文件第2页浏览型号K6R1016V1B-JP12的Datasheet PDF文件第3页浏览型号K6R1016V1B-JP12的Datasheet PDF文件第5页浏览型号K6R1016V1B-JP12的Datasheet PDF文件第6页浏览型号K6R1016V1B-JP12的Datasheet PDF文件第7页 
PRELIMINARY  
Preliminary  
PRELIMINARY  
CMOS SRAM  
K6R1016V1B-C/B-L, K6R1016V1B-I/B-P  
AC CHARACTERISTICS(TA=0 to 70°C, VCC=3.3±0.3V, unless otherwise noted.)  
TEST CONDITIONS*  
Parameter  
Value  
0V to 3V  
3ns  
Input Pulse Levels  
Input Rise and Fall Times  
Input and Output timing Reference Levels  
Output Loads  
1.5V  
See below  
* The above test conditions are also applied at industrial temperature range.  
Output Loads(A)  
Output Loads(B)  
for tHZ, tLZ, tWHZ, tOW, tOLZ & tOHZ  
+3.3V  
RL = 50W  
DOUT  
319W  
VL = 1.5V  
DOUT  
30pF*  
ZO = 50W  
353W  
5pF*  
* Capacitive Load consists of all components of the  
test environment.  
* Including Scope and Jig Capacitance  
READ CYCLE*  
K6R1016V1B-8  
K6R1016V1B-10  
K6R1016V1B-12  
Sym-  
Parameter  
bol  
Unit  
Min  
8
-
Max  
Min  
10  
-
Max  
Min  
12  
-
Max  
Read Cycle Time  
tRC  
tAA  
-
8
8
4
4
-
-
10  
10  
5
5
-
-
12  
12  
6
6
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
Chip Select to Output  
tCO  
tOE  
tBA  
-
-
-
Output Enable to Valid Output  
UB, LB Access Time  
-
-
-
-
-
-
Chip Enable to Low-Z Output  
Output Enable to Low-Z Output  
UB, LB Enable to Low-Z Output  
Chip Disable to High-Z Output  
Output Disable to High-Z Output  
UB, LB Disable to High-Z Output  
Output Hold from Address Change  
tLZ  
3
0
0
0
0
0
3
3
3
tOLZ  
tBLZ  
tHZ  
-
0
-
0
-
-
0
-
0
-
4
4
4
-
0
5
5
5
-
0
6
6
6
-
tOHZ  
tBHZ  
tOH  
0
0
0
0
3
3
* The above parameters are also guaranteed at industrial temperature range.  
Rev 2.1  
August 1998  
- 4 -  

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