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K6R1016V1B-JP12 PDF预览

K6R1016V1B-JP12

更新时间: 2023-06-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管
页数 文件大小 规格书
9页 207K
描述
Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, PLASTIC, SOJ-44

K6R1016V1B-JP12 数据手册

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PRELIMINARY  
Preliminary  
PRELIMINARY  
CMOS SRAM  
K6R1016V1B-C/B-L, K6R1016V1B-I/B-P  
64K x 16 Bit High-Speed CMOS Static RAM(3.3V Operating)  
FEATURES  
• Fast Access Time 8,10,12ns(Max.)  
• Low Power Dissipation  
Standby (TTL) : 50mA(Max.)  
(CMOS): 5mA(Max.)  
GENERAL DESCRIPTION  
The K6R1016V1B is a 1,048,576-bit high-speed Static Random  
Access Memory organized as 65,536 words by 16 bits. The  
K6R1016V1B uses 16 common input and output lines and has  
an output enable pin which operates faster than address  
access time at read cycle. Also it allows that lower and upper  
byte access by data byte control (UB, LB). The device is fabri-  
cated using SAMSUNG¢s advanced CMOS process and  
designed for high-speed circuit technology. It is particularly well  
suited for use in high-density high-speed system applications.  
The K6R1016V1B is packaged in a 400mil 44-pin plastic SOJ  
or TSOP2 forward.  
0.7mA(Max.) L-Ver. only  
Operating K6R1016V1B-8 : 200mA(Max.)  
K6R1016V1B-10: 195mA(Max.)  
K6R1016V1B-12: 190mA(Max.)  
• Single 3.3±0.3V Power Supply  
• TTL Compatible Inputs and Outputs  
• Fully Static Operation  
- No Clock or Refresh required  
• Three State Outputs  
• 2V Minimum Data Retention; L-Ver. only  
• Center Power/Ground Pin Configuration  
• Data Byte Control: LB: I/O1~ I/O8, UB: I/O9~ I/O16  
• Standard Pin Configuration  
PIN CONFIGURATION (Top View)  
A0  
A1  
1
2
3
4
5
6
7
8
9
44 A15  
43 A14  
42 A13  
41 OE  
K6R1016V1B-J: 44-SOJ-400  
K6R1016V1B-T: 44-TSOP2-400BF  
A2  
A3  
A4  
40 UB  
CS  
I/O1  
I/O2  
I/O3  
39 LB  
ORDERING INFORMATION  
38 I/O16  
37 I/O15  
36 I/O14  
35 I/O13  
34 Vss  
33 Vcc  
32 I/O12  
31 I/O11  
30 I/O10  
29 I/O9  
28 N.C  
27 A12  
26 A11  
25 A10  
24 A9  
K6R1016V1B-C8/C10/C12  
Commercial Temp.  
K6R1016V1B-I8/I10/I12  
Industrial Temp.  
I/O4 10  
Vcc 11  
Vss 12  
I/O5 13  
I/O6 14  
I/O7 15  
I/O8 16  
WE 17  
A5 18  
SOJ/  
TSOP2  
FUNCTIONAL BLOCK DIAGRAM  
Clk Gen.  
Pre-Charge Circuit  
A0  
A1  
A2  
A6 19  
Memory Array  
256 Rows  
256x16 Columns  
A7 20  
A3  
A4  
A8 21  
A5  
N.C 22  
23 N.C  
A6  
A7  
PIN FUNCTION  
Data  
Cont.  
I/O Circuit &  
I/O1~I/O8  
Column Select  
Pin Name  
A0 - A15  
WE  
Pin Function  
Data  
Cont.  
Address Inputs  
Write Enable  
Chip Select  
I/O9~I/O16  
Gen.  
CLK  
CS  
A8 A9 A10 A11A12 A13 A14 A15  
OE  
Output Enable  
LB  
Lower-byte Control(I/O1~I/O8)  
Upper-byte Control(I/O9~I/O16)  
Data Inputs/Outputs  
Power(+3.3V)  
UB  
WE  
OE  
I/O1 ~ I/O16  
VCC  
UB  
VSS  
Ground  
LB  
CS  
N.C  
No Connection  
Rev 2.1  
August 1998  
- 2 -  

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