5秒后页面跳转
K4S56323PF-FF900 PDF预览

K4S56323PF-FF900

更新时间: 2023-01-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
12页 143K
描述
Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, FBGA-90

K4S56323PF-FF900 数据手册

 浏览型号K4S56323PF-FF900的Datasheet PDF文件第2页浏览型号K4S56323PF-FF900的Datasheet PDF文件第3页浏览型号K4S56323PF-FF900的Datasheet PDF文件第4页浏览型号K4S56323PF-FF900的Datasheet PDF文件第5页浏览型号K4S56323PF-FF900的Datasheet PDF文件第6页浏览型号K4S56323PF-FF900的Datasheet PDF文件第7页 
K4S56323PF-F(H)G/F  
Mobile-SDRAM  
2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 1.8V power supply.  
The K4S56323PF is 268,435,456 bits synchronous high data  
rate Dynamic RAM organized as 4 x 2,097,152 words by 32 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 90Balls FBGA ( -FXXX -Pb, -HXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4S56323PF-F(H)G/F75  
K4S56323PF-F(H)G/F90  
K4S56323PF-F(H)G/F1L  
133MHz(CL=3), 83MHz(CL2)  
111MHz(CL=3), 83MHz(CL2)  
90 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1, 66MHz(CL2)  
- F(H)G : Low Power, Extended Temperature(-25°C ~ 85°C)  
- F(H)F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
NOTES :  
1. In case of 40MHz Frequency, CL1 can be supported.  
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.  
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific pur  
pose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.  
Address configuration  
Organization  
Bank  
Row  
Column Address  
8Mx32  
BA0,BA1  
A0 - A11  
A0 - A8  
1
September 2004  

与K4S56323PF-FF900相关器件

型号 品牌 描述 获取价格 数据表
K4S56323PF-FG SAMSUNG 2M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

获取价格

K4S56323PF-FG1L SAMSUNG Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90

获取价格

K4S56323PF-FG1L0 SAMSUNG Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, FBGA-90

获取价格

K4S56323PF-FG75 SAMSUNG Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90

获取价格

K4S56323PF-FG750 SAMSUNG Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90

获取价格

K4S56323PF-FG90 SAMSUNG Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90

获取价格