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K4S280832D-NC7C PDF预览

K4S280832D-NC7C

更新时间: 2024-02-16 20:51:46
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
11页 113K
描述
Synchronous DRAM, 16MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.441 INCH, 0.40 MM PITCH, STSOP2-54

K4S280832D-NC7C 技术参数

生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP,针数:54
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.83
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G54
长度:11.2 mm内存密度:134217728 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:54字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.4 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

K4S280832D-NC7C 数据手册

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K4S280832D  
CMOS SDRAM  
PIN CONFIGURATION (Top view)  
VDD  
DQ0  
VDDQ  
N.C  
DQ1  
VSSQ  
N.C  
DQ2  
VDDQ  
N.C  
DQ3  
VSSQ  
N.C  
VDD  
N.C  
WE  
CAS  
RAS  
CS  
1
2
3
4
5
6
7
8
VSS  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
DQ7  
VSSQ  
N.C  
DQ6  
VDDQ  
N.C  
DQ5  
VSSQ  
N.C  
DQ4  
VDDQ  
N.C  
VSS  
N.C/RFU  
DQM  
CLK  
CKE  
N.C  
A11  
A9  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
54Pin sTSOP (II)  
(400mil x 441mil)  
(0.4 mm Pin pitch)  
BA0  
BA1  
A10/AP  
A0  
A8  
A7  
A6  
A5  
A4  
VSS  
A1  
A2  
A3  
VDD  
PIN FUNCTION DESCRIPTION  
Pin  
Name  
System clock  
Input Function  
Active on the positive going edge to sample all inputs.  
CLK  
Disables or enables device operation by masking or enabling all inputs except  
CLK, CKE and DQM  
CS  
Chip select  
Masks system clock to freeze operation from the next clock cycle.  
CKE should be enabled at least one cycle prior to new command.  
Disable input buffers for power down in standby.  
CKE  
Clock enable  
Row/column addresses are multiplexed on the same pins.  
Row address : RA0 ~ RA11, Column address : CA0 ~ CA9  
A0 ~ A11  
BA0 ~ BA1  
RAS  
Address  
Selects bank to be activated during row address latch time.  
Selects bank for read/write during column address latch time.  
Bank select address  
Row address strobe  
Column address strobe  
Write enable  
Latches row addresses on the positive going edge of the CLK with RAS low.  
Enables row access & precharge.  
Latches column addresses on the positive going edge of the CLK with CAS low.  
Enables column access.  
CAS  
Enables write operation and row precharge.  
Latches data in starting from CAS, WE active.  
WE  
Makes data output Hi-Z, tSHZ after the clock and masks the output.  
Blocks data input when DQM active.  
DQM  
Data input/output mask  
DQ0 ~ 7  
VDD/VSS  
Data input/output  
Data inputs/outputs are multiplexed on the same pins.  
Power and ground for the input buffers and the core logic.  
Power supply/ground  
Isolated power supply and ground for the output buffers to provide improved noise  
immunity.  
VDDQ/VSSQ  
N.C/RFU  
Data output power/ground  
No connection  
/reserved for future use  
This pin is recommended to be left No Connection on the device.  
Rev. 0.1 Sept. 2001  

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