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K4M513233E-F1L PDF预览

K4M513233E-F1L

更新时间: 2024-11-10 22:30:43
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
12页 142K
描述
4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

K4M513233E-F1L 数据手册

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K4M513233E - M(E)C/L/F  
Mobile-SDRAM  
4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 3.0V & 3.3V power supply.  
The K4M513233E is 536,870,912 bits synchronous high data  
rate Dynamic RAM organized as 4 x 4,196,304 words by 32 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (8K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• 2Chips DDP 90Balls FBGA with 0.8mm ball pitch  
( -MXXX : Leaded, -EXXX : Lead Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M513233E-M(E)C/L/F75  
K4M513233E-M(E)C/L/F1H  
K4M513233E-M(E)C/L/F1L  
133MHz(CL=3)  
105MHz(CL=2)  
90 FBGA  
Leaded (Lead Free)  
LVCMOS  
105MHz(CL=3)*1  
- M(E)C/L/F : Normal / Low / Low Power, Commercial Temperature(-25°C ~ 70°C)  
NOTES :  
1. In case of 40MHz Frequency, CL1 can be supported.  
2. Samsung shall not offer for sale or sell either directly or through and third-party proxy, and DRAM memory products that include "Multi-Die Plastic  
DRAM" for use as components in general and scientific computers such as, by way of example, mainframes, servers, work stations or desk top  
computers for the first three years of five year term of this license. Nothing herein limits the rights of Samsung to use Multi-Die Plastic DRAM in other  
products or other applications under paragrangh such as mobile, telecom or non-computer application(which include by way of example laptop or  
notebook computers, cell phones, televisions or visual monitors)  
Violation may subject the customer to legal claims and also excludes any warranty against infringement from Samsung." .  
3. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.  
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific  
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.  
February 2004  

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