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K4M283233H-FG60 PDF预览

K4M283233H-FG60

更新时间: 2024-11-11 04:22:31
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
12页 143K
描述
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA

K4M283233H-FG60 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:FBGA, BGA90,9X15,32Reach Compliance Code:unknown
风险等级:5.92最长访问时间:60 ns
最大时钟频率 (fCLK):166 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PBGA-B90
内存密度:134217728 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:32端子数量:90
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-25 °C
组织:4MX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA90,9X15,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH电源:3/3.3 V
认证状态:Not Qualified刷新周期:4096
连续突发长度:1,2,4,8,FP最大待机电流:0.0005 A
子类别:DRAMs最大压摆率:0.14 mA
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM

K4M283233H-FG60 数据手册

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K4M283233H - F(H)N/G/L/F  
Mobile SDRAM  
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA  
FEATURES  
GENERAL DESCRIPTION  
• 3.0V & 3.3V power supply.  
The K4M283233H is 134,217,728 bits synchronous high data  
rate Dynamic RAM organized as 4 x 1,048,576 words by 32 bits,  
fabricated with SAMSUNG’s high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 90Balls FBGA ( -FXXX -Pb, -HXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M283233H-F(H)N/G/L/F60  
K4M283233H-F(H)N/G/L/F75  
K4M283233H-F(H)N/G/L/F7L  
166MHz(CL=3)  
90 FBGA Pb  
(Pb Free)  
LVCMOS  
133MHz(CL=3), 111MHz(CL=2)  
133MHz(CL=3)*1, 83MHz(CL=2)  
- F(H)N/G : Low Power, Extended Temperature(-25°C ~ 85°C)  
- F(H)L/F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
Address configuration  
Organization  
Bank  
Row  
A0 - A11  
Column Address  
4M x 32  
BA0, BA1  
A0 - A7  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-  
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could  
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-  
visions may apply.  
1
January 2006  

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