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K4H510838B-GLB00 PDF预览

K4H510838B-GLB00

更新时间: 2024-11-14 14:42:59
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
24页 392K
描述
DDR DRAM, 64MX8, 0.75ns, CMOS, PBGA60, FBGA-60

K4H510838B-GLB00 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:TBGA,
针数:60Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.28
风险等级:5.34访问模式:FOUR BANK PAGE BURST
最长访问时间:0.75 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PBGA-B60JESD-609代码:e0
长度:12 mm内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:60字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64MX8封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:10 mmBase Number Matches:1

K4H510838B-GLB00 数据手册

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DDR SDRAM 512Mb B-die (x4, x8, x16)  
DDR SDRAM  
512Mb B-die DDR SDRAM Specification  
60 FBGA  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.3 June. 2005  

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