生命周期: | Obsolete | 零件包装代码: | TSOP2 |
包装说明: | TSOP2, | 针数: | 66 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.28 | 风险等级: | 5.84 |
Is Samacsys: | N | 访问模式: | FOUR BANK PAGE BURST |
最长访问时间: | 0.6 ns | 其他特性: | AUTO/SELF REFRESH |
JESD-30 代码: | R-PDSO-G66 | 长度: | 22.22 mm |
内存密度: | 536870912 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 4 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 66 |
字数: | 134217728 words | 字数代码: | 128000000 |
工作模式: | SYNCHRONOUS | 组织: | 128MX4 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP2 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
自我刷新: | YES | 最大供电电压 (Vsup): | 2.7 V |
最小供电电压 (Vsup): | 2.3 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 宽度: | 10.16 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4H510438G-LCC00 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.55ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 |
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K4H510438G-LLB3 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.7ns, CMOS, PDSO66, |
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K4H510438J-BCCC0 | SAMSUNG |
获取价格 |
DDR DRAM, 64MX8, 0.65ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 |
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K4H510438J-BIB30 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.7ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 |
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K4H510438J-BICC0 | SAMSUNG |
获取价格 |
DDR DRAM, 32MX16, 0.65ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 |
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K4H510438J-BLCCT | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.65ns, CMOS, PBGA60 |
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K4H510438J-BPB3T | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.7ns, CMOS, PBGA60 |
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K4H510438J-BPCC0 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.65ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 |
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K4H510438J-BPCCT | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.65ns, CMOS, PBGA60 |
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K4H510438J-LCCC0 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX4, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, HALOGEN FREE AN |
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