5秒后页面跳转
K4E641611D-TC60 PDF预览

K4E641611D-TC60

更新时间: 2024-02-27 12:17:06
品牌 Logo 应用领域
三星 - SAMSUNG 存储内存集成电路光电二极管动态存储器
页数 文件大小 规格书
36页 884K
描述
4M x 16bit CMOS Dynamic RAM with Extended Data Out

K4E641611D-TC60 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSOP, TSOP50,.46,32Reach Compliance Code:unknown
风险等级:5.92最长访问时间:60 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G50
JESD-609代码:e0内存密度:67108864 bit
内存集成电路类型:EDO DRAM内存宽度:16
端子数量:50字数:4194304 words
字数代码:4000000最高工作温度:70 °C
最低工作温度:组织:4MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP封装等效代码:TSOP50,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
电源:5 V认证状态:Not Qualified
刷新周期:4096自我刷新:NO
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.11 mA标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUALBase Number Matches:1

K4E641611D-TC60 数据手册

 浏览型号K4E641611D-TC60的Datasheet PDF文件第2页浏览型号K4E641611D-TC60的Datasheet PDF文件第3页浏览型号K4E641611D-TC60的Datasheet PDF文件第4页浏览型号K4E641611D-TC60的Datasheet PDF文件第5页浏览型号K4E641611D-TC60的Datasheet PDF文件第6页浏览型号K4E641611D-TC60的Datasheet PDF文件第7页 
K4E661611D,K4E641611D  
CMOS DRAM  
4M x 16bit CMOS Dynamic RAM with Extended Data Out  
DESCRIPTION  
This is a family of 4,194,304 x 16 bit Extended Data Out Mode CMOS DRAMs. Extended Data Out Mode offers high speed random  
access of memory cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-50 or -60) are optional features of this  
family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. This 4Mx16 EDO Mode DRAM  
family is fabricated using Samsung¢s advanced CMOS process to realize high band-width, low power consumption and high reliability.  
FEATURES  
• Extended Data Out Mode operation  
• Part Identification  
• 2 CAS Byte/Word Read/Write operation  
- K4E661611D-TC(5.0V, 8K Ref.)  
- K4E641611D-TC(5.0V, 4K Ref.)  
• CAS-before-RAS refresh capability  
• RAS-only and Hidden refresh capability  
• Fast parallel test mode capability  
• TTL(5.0V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
ActivePowerDissipation  
Unit : mW  
4K  
• Available in Plastic TSOP(II) package  
• +5.0V±10% power supply  
Speed  
-50  
8K  
495  
440  
660  
-60  
605  
Refresh Cycles  
Part  
NO.  
Refresh  
cycle  
Refresh time  
FUNCTIONAL BLOCK DIAGRAM  
Normal  
K4E661611D*  
K4E641611D  
8K  
4K  
64ms  
RAS  
UCAS  
LCAS  
W
Vcc  
Vss  
Control  
Clocks  
VBB Generator  
* Access mode & RAS only refresh mode  
: 8K cycle/64ms  
Lower  
Data in  
Buffer  
CAS-before-RAS & Hidden refresh mode  
: 4K cycle/64ms  
DQ0  
to  
DQ7  
Row Decoder  
Refresh Timer  
Lower  
Data out  
Buffer  
Refresh Control  
Memory Array  
Performance Range  
OE  
4,194,304 x 16  
Cells  
Refresh Counter  
Row Address Buffer  
Col. Address Buffer  
Upper  
Data in  
Buffer  
Speed  
tRAC  
50ns  
60ns  
tCAC  
13ns  
15ns  
tRC  
tHPC  
20ns  
25ns  
A0~A12  
(A0~A11)*1  
DQ8  
to  
DQ15  
-50  
-60  
84ns  
104ns  
Upper  
Data out  
Buffer  
A0~A8  
(A0~A9)*1  
Column Decoder  
Note) *1 : 4K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

与K4E641611D-TC60相关器件

型号 品牌 描述 获取价格 数据表
K4E641611D-TC600 SAMSUNG 暂无描述

获取价格

K4E641612B SAMSUNG 4M x 16bit CMOS Dynamic RAM with Extended Data Out

获取价格

K4E641612B-L SAMSUNG 4M x 16bit CMOS Dynamic RAM with Extended Data Out

获取价格

K4E641612B-TC SAMSUNG 4M x 16bit CMOS Dynamic RAM with Extended Data Out

获取价格

K4E641612B-TC45 SAMSUNG EDO DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50

获取价格

K4E641612B-TC450 SAMSUNG EDO DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50

获取价格