IGBT with Diode
IXSK 50N60BU1 VCES
IXSX 50N60BU1 IC25
= 600 V
= 75 A
VCE(sat) = 2.5 V
Short Circuit SOA Capability
PLUS247
(IXSX)
Symbol
TestConditions
MaximumRatings
C (TAB)
G
VCES
VCGR
TJ = 25°C to 150°C
600
600
V
C
E
TJ = 25°C to 150°C; RGE = 1 MW
V
TO-264 AA
(IXSK)
VGES
VGEM
Continuous
Transient
±20
±30
V
V
IC25
IC90
ICM
TC = 25°C, limited by leads
TC = 90°C
75
50
A
A
A
G
C
E
TC = 25°C, 1 ms
200
SSOA
(RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 22 W
Clamped inductive load, L = 30 mH
ICM = 100
@ 0.8 VCES
A
ms
W
G = Gate,
E = Emitter,
C = Collector,
TAB = Collector
tSC
(SCSOA)
VGE= 15 V, VCE = 360 V, TJ = 125°C
RG = 22 W, non repetitive
10
Features
• Internationalstandardpackage
PC
TC = 25°C
300
JEDEC TO-264 AA, and hole-less
TO-247 package for clip mounting
• Guaranteed Short Circuit SOA
capability
• High frequency IGBT and anti-
parallel FRED in one package
• Latest generation HDMOSTM process
• Low VCE(sat)
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
-55 ... +150
Md
Mountingtorque
0.9/6 Nm/lb.in.
Weight
10
g
- forminimumon-stateconduction
losses
• MOS Gate turn-on
Maximumleadtemperatureforsoldering
1.6 mm (0.062 in.) from case for 10 s
300
°C
- drive simplicity
• Fast RecoveryEpitaxial Diode (FRED)
- soft recovery with low IRM
Applications
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptiblepowersupplies(UPS)
• Switch-modeandresonant-mode
powersupplies
BVCES
VGE(th)
IC = 3 mA, VGE = 0 V
IC = 4 mA, VCE = VGE
600
4
V
8
V
ICES
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
TJ = 125°C
325
17 mA
mA
Advantages
• Space savings (two devices in one
package)
• Easy to mount with 1 screw
(isolatedmountingscrewhole)
• Reduces assembly time and cost
IGES
VCE = 0 V, VGE = ±20 V
±100
2.5
nA
V
VCE(sat)
IC = IC90; VGE = 15 V,
2.2
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
97520A(12/98)
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