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IXDD609CI PDF预览

IXDD609CI

更新时间: 2024-11-13 20:24:43
品牌 Logo 应用领域
力特 - LITTELFUSE 局域网驱动接口集成电路驱动器
页数 文件大小 规格书
14页 288K
描述
Buffer/Inverter Based MOSFET Driver, ROHS COMPLIANT, TO-220AB, 5 PIN

IXDD609CI 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.33高边驱动器:NO
接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVERJESD-30 代码:R-XSFM-T5
功能数量:1端子数量:5
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT认证状态:Not Qualified
最大供电电压:35 V最小供电电压:4.5 V
标称供电电压:18 V表面贴装:NO
温度等级:AUTOMOTIVE端子形式:THROUGH-HOLE
端子位置:SINGLE断开时间:0.075 µs
接通时间:0.075 µsBase Number Matches:1

IXDD609CI 数据手册

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IXD_609  
9-Ampere Low-Side  
Ultrafast MOSFET Drivers  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
9A Peak Source/Sink Drive Current  
Wide Operating Voltage Range: 4.5V to 35V  
-40°C to +125°C Extended Operating Temperature  
Range  
Logic Input Withstands Negative Swing of up to 5V  
Matched Rise and Fall Times  
The IXDD609/IXDI609/IXDN609 high-speed gate  
drivers are especially well suited for driving the latest  
IXYS MOSFETs and IGBTs. The IXD_609  
high-current output can source and sink 9A of peak  
current while producing voltage rise and fall times of  
less than 25ns. The input is CMOS compatible, and is  
virtually immune to latch up. Proprietary circuitry  
eliminates cross-conduction and current  
Low Propagation Delay Time  
Low, 10A Supply Current  
Low Output Impedance  
“shoot-through.Low propagation delay and fast,  
matched rise and fall times make the IXD_609 family  
ideal for high-frequency and high-power applications.  
Applications  
Efficient Power MOSFET and IGBT Switching  
Switch Mode Power Supplies  
Motor Controls  
DC to DC Converters  
Class-D Switching Amplifiers  
Pulse Transformer Driver  
The IXDD609 is configured as a non-inverting driver  
with an enable, the IXDN609 is configured as a  
non-inverting driver, and the IXDI609 is configured as  
an inverting driver.  
The IXD_609 family is available in a standard 8-pin  
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC  
with an exposed metal back (SI); an 8-pin DFN (D2); a  
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).  
Ordering Information  
Logic  
Part Number  
Packing  
Method  
Package Type  
8-Pin DFN  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
Quantity  
Configuration  
IXDD609D2TR  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
2000  
100  
2000  
100  
2000  
50  
IXDD609SI  
IXDD609SITR  
IXDD609SIA  
IXDD609SIATR  
IXDD609PI  
IXDD609CI  
IXDD609YI  
IXDI609SI  
IN  
OUT  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
EN  
Tube  
Tube  
Tube  
50  
50  
5-Pin TO-263  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
100  
2000  
100  
2000  
50  
IXDI609SITR  
IXDI609SIA  
IXDI609SIATR  
IXDI609PI  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
IN  
OUT  
IXDI609CI  
Tube  
50  
IXDI609YI  
5-Pin TO-263  
Tube  
50  
IXDN609SI  
IXDN609SITR  
IXDN609SIA  
IXDN609SIATR  
IXDN609PI  
IXDN609CI  
IXDN609YI  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin SOIC  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
100  
2000  
100  
2000  
50  
IN  
OUT  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
5-Pin TO-263  
Tube  
Tube  
50  
50  
DS-IXD_609-R09  
www.ixysic.com  
1

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