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IWR6843AQSABLR PDF预览

IWR6843AQSABLR

更新时间: 2024-09-18 02:49:43
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
80页 2635K
描述
IWR6843, IWR6443 Single-Chip 60- to 64-GHz mmWave Sensor

IWR6843AQSABLR 数据手册

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IWR6843,IWR6443
SWRS219D – OCTOBER 2018 – REVISED SEPTEMBER 2020  
IWR6843, IWR6443 Single-Chip 60- to 64-GHz mmWave Sensor  
Other interfaces available to user application  
– Up to 6 ADC channels (low sample rate  
monitoring)  
1 Features  
FMCW transceiver  
– Integrated PLL, transmitter, receiver, Baseband,  
and A2D  
– Up to 2 SPI ports  
– Up to 2 UARTs  
– 60- to 64-GHz coverage with 4-GHz continuous  
bandwidth  
– 1 CAN-FD interface  
– I2C  
– Four receive channels  
– Three transmit channels  
– Supports 6-bit phase shifter for TX Beam  
forming  
– Ultra-accurate chirp engine based on fractional-  
N PLL  
– GPIOs  
– 2 lane LVDS interface for raw ADC data and  
debug instrumentation  
Functional Safety-Compliant targeted  
– Developed for functional safety applications  
– Documentation will be available to aid IEC  
61508 functional safety system design  
– Hardware integrity up to SIL-2 targeted  
– Safety-related certification  
– TX power: 12 dBm  
– RX noise figure:  
12 dB  
– Phase noise at 1 MHz:  
–93 dBc/Hz  
IEC 61508 certification by TUV Sud planned  
Non-Functional safety variants  
Power management  
– Built-in LDO network for enhanced PSRR  
– I/Os support dual voltage 3.3 V/1.8 V  
Clock source  
– 40.0 MHz crystal with internal oscillator  
– Supports external oscillator at 40 MHz  
– Supports externally driven clock (square/sine)  
at 40 MHz  
Built-in calibration and self-test  
– ARM® Cortex®-R4F-based radio control system  
– Built-in firmware (ROM)  
– Self-calibrating system across frequency and  
temperature  
– Embedded self-monitoring with no host  
processor involvement on Functional Safety-  
Compliant targeted devices  
C674x DSP for advanced signal processing  
(IWR6843 only)  
Hardware accelerator for FFT, filtering, and CFAR  
processing  
Memory compression  
Easy hardware design  
– 0.65-mm pitch, 161-pin 10.4 mm × 10.4 mm flip  
chip BGA package for easy assembly and low-  
cost PCB design  
– Small solution size  
Operating conditions:  
ARM-R4F microcontroller for object detection, and  
interface control  
– Supports autonomous mode (loading user  
application from QSPI flash memory)  
Internal memory with ECC  
– Junction temperature range of –40°C to 105°C  
– IWR6843: 1.75 MB, divided into MSS program  
RAM (512 KB), MSS data RAM (192 KB), DSP  
L1 RAM (64KB) and L2 RAM (256 KB), and L3  
radar data cube RAM (768 KB)  
– IWR6443: 1.4 MB, divided into MSS program  
RAM (512 KB), MSS data RAM (192 KB), and  
L3 radar data cube RAM (768 KB)  
Technical reference manual includes allowed  
size modifications  
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 

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