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ITF87008DQT PDF预览

ITF87008DQT

更新时间: 2024-11-08 22:24:31
品牌 Logo 应用领域
英特矽尔 - INTERSIL /
页数 文件大小 规格书
13页 206K
描述
7.0A, 20V, 0.023 Ohm, Dual N-Channel, 2.5V Specified Power MOSFET

ITF87008DQT 数据手册

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ITF87008DQT  
Data Sheet  
March 2000  
File Number 4814.2  
7.0A, 20V, 0.023 Ohm, Dual N-Channel,  
2.5V Specified Power MOSFET  
Features  
• Ultra Low On-Resistance  
- r  
- r  
- r  
= 0.023Ω, VGS = 4.5V  
DS(ON)  
DS(ON)  
DS(ON)  
Packaging  
= 0.024Ω, VGS = 4.0V  
= 0.029Ω, VGS = 2.5V  
TSSOP-8  
• 2.5 Volt Gate Drive Capability  
• Gate to Source Protection Diode  
• Simulation Models  
5
1
2
4
3
- Temperature Compensated PSPICE™ and SABER  
Electrical Models  
- Spice and SABER Thermal Impedance Models  
- www.intersil.com  
• Peak Current vs Pulse Width Curve  
Symbol  
Transient Thermal Impedance Curve vs Board Mounting  
Area  
• Switching Time vs R  
GS  
Curves  
DRAIN1(1)  
SOURCE1(2)  
SOURCE1(3)  
GATE1(4)  
(8) DRAIN2  
(7) SOURCE2  
(6) SOURCE2  
(5) GATE2  
Ordering Information  
PART NUMBER  
PACKAGE  
BRAND  
ITF87008DQT  
TSSOP-8  
87008  
NOTE: When ordering, use the entire part number. ITF87008DQT2  
is available only in tape and reel.  
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified  
A
ITF87008DQT  
UNITS  
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
20  
20  
V
V
V
DSS  
Drain to Gate Voltage (R  
GS  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
±12  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
= 4.5V) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 4.0V) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
7.0  
7.0  
2.0  
A
A
A
A
A
GS  
D
D
o
Continuous (T = 25 C, V  
A
GS  
o
Continuous (T = 100 C, V  
= 4.0V) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 2.5V) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
A
GS  
D
o
Continuous (T = 100 C, V  
2.0  
A
GS  
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
Figure 4  
DM  
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.0  
16  
W
mW/ C  
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 150  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
Package Body for 10s, See Techbrief TB370. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
300  
260  
C
C
L
o
pkg  
NOTES:  
o
o
1. T = 25 C to 125 C.  
J
o
2
2
2. 62.5 C/W measured using FR-4 board with 0.50 in (322.6 mm ) copper pad at 1 second.  
o
2
2
3. 230 C/W measured using FR-4 board with 0.0022 in (1.44 mm ) copper pad at 1000 seconds.  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.  
SABER© is a Copyright of Analogy Inc. PSPICE® is a registered trademark of MicroSim Corporation.  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000  

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