ITF87056DQT
Data Sheet
March 2000
File Number 4813.2
5A, 20V, 0.045 Ohm, Dual P-Channel,
2.5V Specified Power MOSFET
Features
• Ultra Low On-Resistance
- r
- r
- r
= 0.045Ω, VGS = −4.5V
DS(ON)
DS(ON)
DS(ON)
Packaging
= 0.048Ω, VGS = −4.0V
= 0.077Ω, VGS = −2.5V
TSSOP-8
• 2.5V Gate Drive Capability
• Gate to Source Protection Diode
• Simulation Models
5
1
2
4
3
- Temperature Compensated PSPICE™ and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
Symbol
• Switching Time vs R
GS
Curves
DRAIN1(1)
OURCE1(2)
(8) DRAIN2
(7) SOURCE2
(6) SOURCE2
(5) GATE2
Ordering Information
SOURCE1(3)
GATE1(4)
PART NUMBER
PACKAGE
BRAND
ITF87056DQT
TSSOP-8
87056
NOTE: When ordering, use the entire part number. ITF87056DQT2
is available only in tape and reel.
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
A
ITF87056DQT
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
-20
-20
±12
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
o
Continuous (T = 25 C, V
= -4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= -4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
5.0
5.0
3.0
A
A
A
A
A
GS
D
D
o
Continuous (T = 25 C, V
A
GS
o
Continuous (T = 100 C, V
= -4.0V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= -2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
A
GS
D
o
Continuous (T = 100 C, V
2.5
A
GS
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Figure 4
DM
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.0
16
W
mW/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 150
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB370. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
o
o
1. T = 25 C to 125 C.
J
o
2
2
2. 62.5 C/W measured using FR-4 board with 0.50 in (322.6 mm ) copper pad at 1 second.
o
2
2
3. 230 C/W measured using FR-4 board with 0.0022 in (1.44 mm ) copper pad at 1000 seconds.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. PSPICE® is a registered trademark of MicroSim Corporation.
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