ITF86130SK8T
TM
Data Sheet
June 2000
File Number 4798.4
14A, 30V, 0.0078 Ohm, N-Channel, Logic
Level, Power MOSFET
Features
• Ultra Low On-Resistance
- r
- r
- r
= 0.0078Ω, VGS = 10V
DS(ON)
DS(ON)
DS(ON)
Packaging
= 0.010Ω, VGS = 4.5V
= 0.012Ω, VGS = 4.0V
SO8 (JEDEC MS-012AA)
BRANDING DASH
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER
Electrical Models
5
1
2
3
4
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
Symbol
• Switching Time vs R
GS
Curves
SOURCE(1)
SOURCE(2)
DRAIN(8)
DRAIN(7)
Ordering Information
PART NUMBER
PACKAGE
BRAND
ITF86130SK8T
SO8
86130
SOURCE(3)
GATE(4)
DRAIN(6)
DRAIN(5)
NOTE: When ordering, use the entire part number. ITF86130SK8T
is available only in tape and reel.
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
A
ITF86130SK8T
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
30
30
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
±20
GS
Drain Current
o
Continuous (T = 25 C, V
= 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
14.0
12.0
7.0
7.0
Figure 4
A
A
A
A
A
A
GS
D
D
o
Continuous (T = 25 C, V
A
GS
o
Continuous (T = 100 C, V
= 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
A
GS
D
o
Continuous (T = 100 C, V
A
GS
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5
20
W
mW/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 150
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Tech brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
o
o
1. T = 25 C to 125 C.
J
o
2
2
2. 50 C/W measured using FR-4 board with 0.76in (490.3mm ) copper pad at 10s.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1
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