Datasheet > IT3M-200S-BGA57

IT3M-200S-BGA57

更新时间： 2024-11-20 05:39:47

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
20页	1602K
描述
High-Speed(10+Gbps) BGA Mezzanine Connectors

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中文翻译

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数据手册

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IT3M-200S-BGA57 数据手册

NEW

High-Speed(10⁺Gbps) BGA Mezzanine Connectors

IT3 Series

ꢀFlexibility

Hirose’s IT3 mezzanine connector system is as

comfortable in today’s data rates of PCIe and XAUI

as it is in tomorrow’s 10⁺Gbps systems.

With the ability to transmit differential, single-ended,

and power through one package and being stackable

from 15 – 40mm, IT3 can solve your interface needs

for both current and future generations.

ꢀMechanical features

ꢀ Unique 3-piece structure for flexibility

ꢀ Stacking heights from 15 to 40mm

(^*15mmH is 2-piece)

∞

ꢀ Staggered 1.5mm 1.75mm ball grid array

Interposer

Signal Ground

ꢀ Number of Contacts: 100, 200, &300 signals

+ 90% additional grounds

ꢀ Differential, single-ended, and power

ꢀ Low mating/extracting forces

ꢀ Wide misalignment tolerances for multiple

connector use

Signal / Ground Configuration

ꢀ Both of SnPb and Pb-free are available

ꢀ Excellent reflow solderability

ꢀSignal integrity features

ꢀ

Insertion loss to Crosstalk Ratio (ICR)

60�

50�

40�

30�

20�

10�

�

0�

�

The ICR performance meets the extrapolated

IEEE 802.3ap specification for 6.25Gbps with

fully-populated pin assignment, and 10⁺Gbps

with skipped pin assignment.

ICR�

IEEE spec�

-10�

-20�

-30�

-40�

ꢀ Return Loss

The differential return loss meets the

extrapolated IEEE 802.3ap specification

up to 12GHz.

RL�

IEEE Spec�

0�

�

-50��

0�

5�

10�

15�

20�

5�

10�

15�

20�

Frequency (GHz)�

ꢀStacking height variations

Stacking Height

17mm

20mm

22mm

25mm

26mm

28mm

30mm

32mm

38mm

40mm

Contact Position

100

200

300

* : Under planning

2010.02

12 3 4 5 6 7...20

中文翻译

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