Datasheet > IT3M-300S-BGA(37)

IT3M-300S-BGA(37)

更新时间： 2024-11-18 18:43:19

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
16页	1793K
描述
Board Connector

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中文翻译

获取价格

技术参数
数据手册

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IT3M-300S-BGA(37) 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	2.15	连接器类型：	BOARD CONNECTOR
Base Number Matches：	1

IT3M-300S-BGA(37) 数据手册

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High-Speed(10 Gbps) BGA Mezzanine Connectors

IT3 Series

■Flexibility

Hirose’s IT3 mezzanine connector system is as

comfortable in today’s data rates of PCIe and

XAUI as it is in tomorrow’s 10 Gbps systems.

With the ability to transmit differential, single-

ended, and power through one package and

being stackable from 14 – 40mm, IT3 can solve

your interface needs for both current and future

generations.

■Mechanical features

● Unique 3-piece structure for flexibility

● Stacking heights from 14 to 40mm

●

Staggered 1.5mm ∞ 1.75mm ball grid array

Number of Contacts: 100, 200, &300 signals

+ 90% additional grounds

Interposer

Signal Ground

● Differential, single-ended, and power

● Low mating/extracting forces

●

Wide misalignment tolerances for multiple

connector use

● Both of SnPb and Pb-free are available

● Excellent reflow solderability

Signal / Ground Configuration

● IT3 is inter-mateable with IT5 Series

■Signal integrity features

●

Insertion loss to Crosstalk Ratio (ICR)

The ICR performance meets the

extrapolated IEEE 802.3ap

specification for 6.25Gbps with

fully-populated pin assignment,

ICR

IEEE spec

-10

-20

-30

and 10 Gbps with skipped pin

assignment.

-40

● Return Loss

IEEE Spec

The differential return loss meets

the extrapolated IEEE 802.3ap

specification up to 12GHz.

-50

Frequency (GHz)

■Stacking height variations

2piece

3piece

Stacking Height

Contact Position

100

200

300

* : Under planning

2017.10⑤

12 3 4 5 6 7...16

中文翻译

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